“…Owing to their high frequency and power handling potentialities, AlGaN/GaN high-electron-mobility transistors (HEMTs) are expected to play substantial roles in future satellite and information technologies [ 1 , 2 , 3 , 4 ]. The majority of the power of such devices is dissipated over relatively small areas of about 0.5–1 μm around the gate contact, resulting in local Joule self-heating [ 5 , 6 , 7 , 8 , 9 , 10 ]. The performance of a device is usually influenced by self-heating; this can be identified by evaluating the thermal impedance on various epi-structures and substrates (Si, SiC, and sapphire) [ 11 , 12 , 13 ].…”