“…[1][2][3] Among NC memories, metal NCs have a number of advantages over their semiconductor counterparts, including higher density states around the Fermi level, stronger coupling with the conduction channel, a wide range of available work functions, and smaller energy perturbation due to carrier confinement. 4 Various methods have been used to form uniform metal NCs, including thermal vapor evaporation, 4,5 molecular beam epitaxy, 6 sputtering deposition, 7 the low-energy ion implantation technique, 8 the Langmuir-Blodgett technique, 9 pulse laser deposition, 10 and oxide reduction. 11 However, most of these methods require high-temperature annealing for the formation of metal NCs, which results in metallic contamination, the formation of metal compounds, and NCs with nonuniform size and arbitrary shape.…”