SEM / SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of Electronic Devices

Altes, A.; Heiderhoff, R.; Balk, L.J.; Joachimsthaler, I.; Zimmermann, G.

doi:10.31399/asm.cp.istfa2002p0003

Cited by 2 publications

(1 citation statement)

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“…This thermal equivalent circuit is depicted in figure 2, whereas the heat source is given by the completely exposed Pt/Rh filament at the apex of the probe. The precondition for this thermal equivalent is the assumption that there are no heat losses to the surrounding air and this neglect has already been legitimized by the investigations in [20,21]. Furthermore, in the electrical sense, this thermal equivalent circuit can be separated into one lead-in and one dissipation part if the heat source, which indeed is given by the complete length of the platinum filament, is just assumed to be a small part at the very end of the loop-shaped wire.…”

Section: Thermal Equivalent Circuit Of Used Probementioning

confidence: 99%

Quantitative dynamic near-field microscopy of thermal conductivity

Altes

Heiderhoff

Balk

2004

J. Phys. D: Appl. Phys.

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A new three-dimensional finite element method model of the conventional resistive thermal probe, usually employed within scanning thermal microscopy (SThM) has been developed. As a result, the line heat source characteristic of the bent thermal sensitive filament seems to permit the explanation of the experimental results within a certain frequency range. The verification of this line heat source characteristic of the thermal probe finally leads to the introduction of a general near-field condition of SThM, which considers the spatial and temporal characteristic of the heat source. Here, the contact area between the probe and the sample is not considered as the source but rather as the aperture between the heat source and the sample. In addition, the combination of this kind of thermal probe with the so-called 3ω-method has been justified for the quantitative determination of the local thermal conductivity. Moreover, the applicable sample thermal conductivity range has been expanded significantly by considering the varying heat flow into the sample within the conditional equation.

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Section: Thermal Equivalent Circuit Of Used Probementioning

confidence: 99%