1990
DOI: 10.1109/16.106248
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Semi-insulating silicon nitride (SinSiN) as a resistive field shield

Abstract: We have developed plasma-deposited semi-inrulating rilicon nitride (SinSiN) as a reGstive sea passivation. In thir paper we briefly review itr properties, then we review how it can be used ar a resistive sea. Finally, we show that SinSiN can be used to improve the breakdown voltage of a high-voltage device by some 20 to 40 V by screening all surface charges. We further show that SinSiN provides device immunity to rurface charges, thereby improving yield and reliability.

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Cited by 20 publications
(12 citation statements)
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“…However, the situation is different for t OX > t OX(OPT) (Fig10(c)), when the breakdown occurs at the junction edge, the simulation results indicate that the breakdown voltage assumes almost the same value after Q F =4.0x10 11 /cm 2 for all the dielectric passivated structures. In fact, the V BD for the semi-insulator passivated structure also overlaps with that of the dielectric passivated structure after Q F =6.5x10 11 /cm 2 .…”
Section: Figure 11mentioning
confidence: 93%
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“…However, the situation is different for t OX > t OX(OPT) (Fig10(c)), when the breakdown occurs at the junction edge, the simulation results indicate that the breakdown voltage assumes almost the same value after Q F =4.0x10 11 /cm 2 for all the dielectric passivated structures. In fact, the V BD for the semi-insulator passivated structure also overlaps with that of the dielectric passivated structure after Q F =6.5x10 11 /cm 2 .…”
Section: Figure 11mentioning
confidence: 93%
“…For the sake of simplicity, it is assumed that all the trapped charges are located at the Si-SiO 2 interface. This typically results in an equivalent surface charge density (Q F ) of the order of 3x10 11 /cm 2 for the non-radiated detector with moderately good oxides, whereas the amount of trapped charge is expected to saturate at 1.0x10 12 /cm 2 , even under heavy irradiation condition, for the [111] Si orientation used in detector fabrication.…”
Section: Device Structure and Simulation Techniquementioning
confidence: 99%
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“…For a-SiN:H deposition, however, no experimental studies of the surface reactions have been reported. Thus, with a view to understanding the properties of a-SiN:H film, we studied the surface reactions of the precursors in SiH 4 -NH 3 and SiH 4 -N 2 gas mixture plasma CVD. To study the surface reaction coefficient, we employed a step coverage method, in which the a-SiN:H film was deposited on a Si wafer with high-aspect-ratio trenches; we compared the film thickness profile on the trench with that obtained from a Monte Carlo simulation.…”
Section: Introductionmentioning
confidence: 99%