Semi‐intrinsic self‐healing performance of liquid‐cored microcapsules in epoxy matrix

Abstract

We present an experimental study on the microcapsule-based semi-intrinsic selfhealing behavior of low viscosity epoxy resin used in Resin Transfer Molding (RTM) process. The microcapsules containing RTM epoxy resin are prepared using in situ polymerization of urea-formaldehyde. Single type of microcapsules with six different agitation rates is prepared, resulting in microcapsules with a mean diameter ranging from 52 to 202 μm. The thermal characteristics of each microcapsule batch are investigated using Differential Scanning Calorimetry (DSC) and Simultaneous Thermal Analysis (STA). In addition to thermal characterization tools, Fourier Transform Infrared Spectroscopy (FTIR) is also used as a qualitative technique to determine the composition of microcapsules. The mechanical properties of the selfhealing specimen such as Mode-I fracture toughness and flexure strength are assessed by a universal testing machine, and the obtained results are compared with the findings in literature. K E Y W O R D S in situ polymerization, microcapsules, mode-I fracture toughness, self-healing How to cite this article: Yilmaz C, Yildiz M, and Menceloglu Y. Semi-intrinsic self-healing performance of liquid-cored microcapsules in epoxy matrix. Adv

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“…Brown et al, reported dicyclopentadiene (DCPD)-urea formaldehyde (PUF) based microcapsules with a diameter range of 10−1000 µm [5]. The influence of agitation rate on the size of the microcapsules reported by Cagatay et al, [6]. DCPD, PUF, and γ-glycidoxy propyl trimethoxy silane (KH560)-based microcapsules of 125 µm diameter and 2−5 µm wall thickness were reported by Wang et al, [7].…”