Sensors and smart electronics in harsh environment applications

Fahrner, W.R.; Job, R.; Werner, Michael

doi:10.1007/s005420100089

Cited by 62 publications

(32 citation statements)

References 2 publications

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“…The packaging step is one of the biggest limitations to the commercialization of sensors as it can be the most costly part of the manufacturing process (Kim et al 2010;Xie et al 2010). Problems due to packaging can account for up to three quarters of all instances of failure of working parts (Fahrner et al 2001;Mohammadi et al 2011). Wire bonding interconnection is one of the important processes in fabrication of silicon pressure sensor (Burla et al 2009;Lellouchi et al 2010).…”

Section: Introductionmentioning

confidence: 98%

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

et al. 2011

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In the process of piezo-resistive pressure sensor packaging, a simple thermo-compression bonding setup has been fabricated to achieve the wire bonding interconnection of a silicon chip with printed circuit board. An annealed gold wire is joined onto a pad surface with a needle-like chisel under a force of 0.5-1.5 N/point. The temperature of the substrate was maintained in the range of 150-200°C and the temperature of the chisel was fixed at around 150°C during wire bonding operation. The tensile strength of the wire bonding was measured with a bonding tester by the destructive-pulling experiment and was found to be at the average of 132 mN/mm 2 . The microstructure of the bonding point was examined by scanning electron microscopy. The interface of the thermo-compression boning was shown to possess an acceptable level of reliability for a micro-electromechanical system (MEMS)-based device. The results showed that this setup can be easily operated for fabrication and is suitable for fabricating not only low-cost pressure sensors, but also other MEMS devices.

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Section: Introductionmentioning

confidence: 98%

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

et al. 2011

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“…Propulsive applications require the exposition to high temperature and pressure or chemical reactions and high radiations doses are used in many clinical environments (Fahrner et al 2001). Great effort is currently made by researchers to select suitable materials able to overcome the operational limits showed by other semiconductors.…”

Section: Introductionmentioning

confidence: 99%

CVD-diamond-based thermocouple for high sensitive temperature measurements

et al. 2005

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The possibility to realize a high sensitive thermocouple by means of boron doped chemical vapour deposition (CVD) diamond was investigated. The thermoelectric power of p-type diamond, grown by plasma enhanced CVD was studied for films of electrical resistivity in the 0.2-40 Ω cm range in order to asses the dependence of thermocouple sensitivity on the doping level. The p-type diamond films were prepared by CH₃OH + B₂O₃ vapour addition to a 1% CH₄-H₂ gas mixture during the growth. The conductive films were then tested tracing the I-V characteristic in order to study the conduction properties of the films. An appropriate experimental setup was built to evaluate the thermoelectric properties of the grown samples for different temperatures imposed between two ends of the samples. Firstly, the output voltage was measured maintaining a reference temperature of 273 K at one end and varying the second temperature between 275.5 and 360.5 K. A constant value of the temperature drop of 5 K was then used for an accurate evaluation of the thermoelectric properties of the diamond films for different value of the average temperature. The measurements provided values of thermoelectric power in the range 0.3-0.6 mV/K while conductivity increases. These values showed different decreasing behaviour with increasing temperature for different resistivity of the sample. In particular, more relevant changes in thermoelectric power were measured for high resistive sample

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“…within it. For example, they can be characterized by high levels of radiation, high explosive risk, extreme temperatures or pressures, and lack of oxygen (Fahrner, Werner, & Job, 2001). On the other hand, harsh environments can also be defined as an environment that is challenging for agents to operate in.…”

Section: Harsh Environments -Definition and Research Challengesmentioning

confidence: 99%

Autonomous robots for harsh environments: a holistic overview of current solutions and ongoing challenges

Wong

Yang

Yan

et al. 2018

Systems Science & Control Engineering

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This paper presents a holistic overview of robotics and autonomous systems developed for applications in harsh environments where interactions with robots are difficult to model due to reasons such as dynamics, uncertainty, complexity and unpredictability. Robots of different characteristics and designs are required to perform different tasks within these environments. A number of classes of robots emerge as particularly favoured by the research community for solving challenging problems in difficult environments. Key examples of these deployments are studied with an analysis on how high-level autonomy is a key issue that must be addressed. The surveyed work suggest that the lack of observable autonomy in many systems are a consequence of both the complexity of the problem and the lack of proven reliability of autonomous solutions for applications that demand high success rates. This paper provides a broad and general overview of autonomous robots deployed in harsh environments and the commonalities of the challenges and existing solutions across application areas, including oil and gas inspection, space exploration, deep-sea operations and search and rescue. ARTICLE HISTORY

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Sensors and smart electronics in harsh environment applications

Cited by 62 publications

References 2 publications

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

CVD-diamond-based thermocouple for high sensitive temperature measurements

Autonomous robots for harsh environments: a holistic overview of current solutions and ongoing challenges

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