Shape Optimization of a Pin Fin Heat Sink

Menrath, Thomas; Rosskopf, Andreas; Simon, F. B.; Groccia, Mario; Schuster, Simone

doi:10.23919/semi-therm50369.2020.9142830

Cited by 6 publications

(2 citation statements)

References 3 publications

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“…Given the availability of design freedoms with 3D printing, many researchers have explored AM techniques for building heat sinks to optimise the thermal performance of devices. There have been many different kinds of 3D-printed heat sinks presented, such as pin [77], fin [78], branched [79], foam-based [80], manifold-microchannel [81], cross-media composite [82], and phase change material integrated [83] heat sinks. In most cases, these heat exchangers feature complex structures that are difficult to fabricate traditional methods.…”

Section: Thermal Management and Packagingmentioning

confidence: 99%

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Zhang

Yuan

2022

IEEE J. Emerg. Sel. Topics Power Electron.

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Additive manufacturing techniques have by far been utilised to make 3D passive components (i.e. resistors, inductors, and capacitors), circuit boards and packages of power electronic devices. This paper provides an overview of automatic assembling technologies and additive manufacturing applications in power converters, as well as the advantages and limitations of each additive manufacturing process in this area. It shows that direct metal laser sintering offers advantages for manufacturing inductors with the conductivity of 68% of the International Annealed Copper Standard (IACS) and magnetic cores with the permeability greater than 10000 at 50 Hz. The additive electronics from Nano Dimension show great promise for fabricating power converter PCBs with the conductivity from 25% to 50% IACS. Additive manufacturing in thermal management and packaging has been extensively studied and will spark more changes in these fields. Besides, the potential of the combination of automated and additive manufacturing in power electronic systems has also been discussed, which sets the basis for future development of advanced manufacturing of power electronics.

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Section: Thermal Management and Packagingmentioning

confidence: 99%

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Zhang

Yuan

2022

IEEE J. Emerg. Sel. Topics Power Electron.

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“…The importance of the topic of efficient power management of electronic components is evidenced by the growing number of publications on topology optimization of fin shapes [30] or heat exchangers [31] using both liquid [32] and air [33] cooling methods. Topology optimization has been performed using either genetic optimization approaches [34] or surrogate modelling-based Bayesian optimization [35]. For this type of optimization, the interpolation scheme such as modified Solid Isotropic Material with Penalization (SIMP) [36], as well as the algorithm based on the method of moving asymptotes (MMA) [37][38][39] and the globally convergent version of MMA (GCMMA) [37,40,41] are often used.…”

Section: Introductionmentioning

confidence: 99%

Optimization of Air Cooling System Using Adjoint Solver Technique

Czerwiński

Wołoszyn

2021

Energies

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Air cooling systems are currently the most popular and least expensive solutions to maintain a safe temperature in electronic devices. Heat sinks have been widely used in this area, allowing for an increase in the effective heat transfer surface area. The main objective of this study was to optimise the shape of the heat sink geometric model using the Adjoint Solver technique. The optimised shape in the context of minimal temperature value behind the heat sink is proposed. The effect of radiation and trapezoidal fin shape on the maximum temperature in the cooling system is also investigated. Simulation studies were performed in Ansys Fluent software using the Reynolds—averaged Navier–Stokes technique. As a result of the simulation, it turned out that not taking into account the radiation leads to an overestimation of temperatures in the system—even by 14 ∘C. It was found that as the angle and height of the fins increases, the temperature value behind the heat sink decreases and the heat source temperature increases. The best design in the context of minimal temperature value behind the heat sink from all analysed cases is obtained for heat sink with deformed fins according to iteration 14. The temperature reduction behind the heat sink by as much as 25 ∘C, with minor changes in heat source temperature, has been achieved.

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