Shape-stable and smart polyrotaxane-based phase change materials with enhanced flexibility and fire-safety

Yin, Guang‐Zhong; López, Alba Marta; Yang, Xiaomei; Ye, Wen; Xu, Baoyun; Hobson, Jose; Wang, De‐Yi

doi:10.1016/j.eurpolymj.2022.111262

Cited by 8 publications

(5 citation statements)

References 32 publications

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“…It exhibits excellent thermal properties and promising applications. Yin et al [ 27 ] developed shape‐stable and intelligent polyalkyl PCMs, which exhibit extremely high elasticity (with elongation rates exceeding 1000%), shape stability, enhanced fire safety, and high thermal conductivity (0.47 W (m K) −1 ). These properties provide a practical method for secure and intelligent thermal processing of electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Thermal Performances of Lauric Acid/Polyvinyl Butyral/Graphene Nanoplates Composite Phase Change Materials

Wang,

Fu,

Fang

2024

Physica Status Solidi (a)

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In recent years, there has been significant progress in the development and application of phase change materials (PCMs) for thermal energy storage. The new lauric acid (LA)/polyvinyl butyral (PVB)/graphene nanoplates (GNP) composite phase change materials (CPCM) are prepared using the solution blending method, in which LA acts as PCM, PVB serves as support material, and GNP is used as thermally conductive enhancer. The prepared CPCM with 80 wt% LA can retain stable shape without leakage. The Fourier‐transform infrared and X‐ray diffractometer results indicate that there is no chemical reaction among the various components of the CPCM. The differential scanning calorimeter results show the CPCM3 (with 80 wt% LA and 5 wt% GNP) has melting latent heat of 134.41 KJ Kg−1 with melting temperature of 41.73 °C. The thermal conductivity tests present that thermal conductivity of CPCM3 is 0.689 W (m K)−1, which is 3.83 times that of the PCM2. The thermogravimetric analyzer results verify that the CPCM possess good thermal stability within the operating temperature range of 35–45 °C without any degradation. The thermal cycling tests indicate that CPCM have good thermal reliability. Therefore, it has promising applications in building energy conservation, solar thermal systems, thermal management, and textiles.

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Section: Introductionmentioning

confidence: 99%

Preparation and Thermal Performances of Lauric Acid/Polyvinyl Butyral/Graphene Nanoplates Composite Phase Change Materials

Wang,

Fu,

Fang

2024

Physica Status Solidi (a)

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“…Phase change materials (PCMs) have been applied in various fields for decades, for example, textile, building, construction, electronics solar energy storage, food storage and so on. [1][2][3][4][5][6][7][8][9][10] The working principle of PCMs is that temperature of PCMs can fluctuate over a certain temperature range while thermal energy can be stored or released according to difference between temperature of PCMs and environment temperature. [11][12][13] The organic PCMs are generally used due to several advantages (e. g., non-corrosion, non-toxicity, high thermal stability, high chemical stability etc.)…”

Section: Introductionmentioning

confidence: 99%

Structural Analysis of Phase Change Materials (PCMs)/Expanded Graphite (EG) Composites and Their Thermal Behavior under Hot and Humid Conditions

et al. 2023

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Expanded graphite (EG) has been used to store phase change materials (PCM) to enhance thermal conductivity and avoid leakage. However, systematic investigation on physical structure of various embedded PCMs in EG is not reported. Besides, the effect of environment on thermal behavior of PCM/EG composites has not been investigated yet. In this work, three common PCMs (including myristic acid (MA), polyethylene glycol (PEG) and paraffin wax (PW)) were embedded in EG and three PCM/EG composites were obtained. As a result, capillary force between EG and PCMs supported encapsulation of PCMs in EG. PCM/EG composites had narrower phase change range while supercooling degree values were different when various PCMs were used. Besides, the hot and humid environment had a side effect on thermal energy storage of PCMs and PCM/EG composites. The inherent hydrophilicity of PCMs was essential for resistance against side effect of moisture on thermal energy storage.

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“…Therefore, solving the imbalance between energy supply and demand and improving energy utilization efficiency have attracted wide attention from researchers. , As one class of advanced energy storage materials, phase change materials (PCMs) can store and release a large amount of latent heat to realize the controllable storage and release of thermal energy, which can improve the high efficiency of energy utilization and can be used in various application areas of life. − In particular, most commercial microelectronic devices accelerate aging at high temperatures, seriously affecting the overall life of electronic equipment. Adding PCM components to microelectronic devices can transfer heat from the surface of the device, thereby alleviating the performance degradation of the device and increasing its service life and safety. , …”

Section: Introductionmentioning

confidence: 99%

“…Adding PCM components to microelectronic devices can transfer heat from the surface of the device, thereby alleviating the performance degradation of the device and increasing its service life and safety. 10,11 PCMs can be divided into inorganic PCMs, organic PCMs, and composite PCMs. 12−14 Organic PCMs mainly include paraffin, 15 polyethylene glycol (PEG), 16 fatty acid, and a fatty alcohol, 17,18 which are widely used due to their low price, nontoxicity, environmentally friendly nature, no undercooling, and phase separation.…”

Section: Introductionmentioning

confidence: 99%

Thermal-Driven Shape Memory Phase Change Materials for Potential Application in Shape Adaptable Microelectronic Devices

Zhou

Zhao

et al. 2023

Ind. Eng. Chem. Res.

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Phase change materials (PCMs) that can effectively improve the efficiency of energy storage and conversion have been used in the field of microelectronic devices for prolonging service life. However, conventional PCMs are easy to cause brittle fractures and damage to microelectronic devices because of their strong rigidity, which cannot perfectly fit the irregular surface of microelectronic devices. Herein, we successfully synthesized a dynamic covalently cross-linked shape memory PCM (HPCM8K) with polyethylene glycol (PEG) as the phase change component, hexamethylene diisocyanate trimer as the crosslinking point, and a disulfide bond as the dynamic covalent bond. The tensile strength and the elongation at break of the designed HPCM8K-1 can reach 27.7 MPa and 853.1%, respectively; meanwhile, HPCM8K has excellent latent heat storage capacity with the highest latent heat of 98.1 J/g. Importantly, these HPCM8K can integrate both traditional elastic shape memory and permanent shape reconstruction capabilities into one PEG-based dynamic cross-linking network after introducing the disulfide bond in the molecular structure. The key point of this work is to introduce exceptional mechanical performance and remarkable shape memory ability into PCMs, greatly improving the operability of shape change and enhancing their shape adaptability for accommodating different surfaces of microelectronic devices.

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Shape-stable and smart polyrotaxane-based phase change materials with enhanced flexibility and fire-safety

Cited by 8 publications

References 32 publications

Preparation and Thermal Performances of Lauric Acid/Polyvinyl Butyral/Graphene Nanoplates Composite Phase Change Materials

Preparation and Thermal Performances of Lauric Acid/Polyvinyl Butyral/Graphene Nanoplates Composite Phase Change Materials

Structural Analysis of Phase Change Materials (PCMs)/Expanded Graphite (EG) Composites and Their Thermal Behavior under Hot and Humid Conditions

Thermal-Driven Shape Memory Phase Change Materials for Potential Application in Shape Adaptable Microelectronic Devices

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