To evaluate the SBS, DC, and rheological valuation of experimental 1 wt % Cur‐loaded‐HNPs orthodontic adhesive to bond bracket to enamel surface treated with PA; Nd: YAG, and Er: Cr, YSGG lasers. Two adhesives were prepared experimental adhesive (EA) and EA loaded with 1‐wt % Cur‐HNP. Surface characterization of Cur‐loaded HNP was performed under SEM along with EDS. Specimens were prepared and conditioned with three different strategies PA‐gel, Er,Cr:YSGG laser, Nd: YAG laser. Following pretreatment brackets were bonded, samples underwent artificial aging and two samples from each enamel pretreatment regime were assessed under SEM via BSE. SBS testing was achieved via UTM followed by failure analysis using ARI. Modified and unmodified adhesives underwent DC using FTIR and rheological valuation was performed. SBS and DC were assessed using ANOVA and post hoc multiple comparison tests. The highest SBS was seen in the enamel surface treated with PA. The lowest SBS was remarked in the enamel surface treated with Nd: YAG laser. Based on ARI it was noted that modified adhesive containing Cur‐HNP exhibited the highest number of failures between 1 and 2. No significant difference was observed between both adhesives in terms of DC. Adhesive modified with 1% Cur‐HNP increased viscosity with a decrease in fluidity. The use of Er,Cr:YSGG laser for enamel pretreatment before bracket placement showed potential as a substitute for conventional acid etching, especially when combined with an experimental orthodontic adhesive containing Cur‐HNPs.