Recently, an epoxy-based resin-Filtek Silorane-has been proposed for restorative fillings. It was the aim of the investigation to evaluate the suitability of this novel resin for orthodontic bracket bonding on unground enamel. Shear bond strength was measured for two adhesives-Filtek Silorane, Transbond XT-in combination with steel, ceramic and polymer brackets. For Filtek Silorane etching was performed with the Silorane self-etching primer, as well as phosphoric acid. The Transbond XT samples were etched with phosphoric acid only and served as the control group. All samples were thermo-cycled (1000×, 5–55 °C). Shear testing was carried out with an Instron 3344. In addition, ARI scores were evaluated. The Shear bond strength showed a weak adhesion of Filtek Silorane to unprepared enamel, either with the self-etching primer or the conventional etching (0.87–4.28 MPa). The Shear bond strength of the control group was significantly higher (7.6–16.5 MPa). The ARI scores showed a clear failure at the enamel-adhesive interface for all Filtek Silorane samples. For the combination of Transbond XT and different brackets the failure was found at the adhesive–bracket interface. The novel epoxy-based resin Filtek Silorane is not appropriate for bracket bonding to unprepared enamel.