Shear Ram Height Investigation for Gold Wire Bond Shear Test

Abstract

This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element model. The effects of the shear ram height on the stress and strain response of the gold ball bond were investigated. The results of the simulation confirms that shear ram height has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test.

Interaction Relationship Analysis of Surface Roughness on Aluminium Etched Wafer Using RIE

“…In order to visualize the effects, the interaction plot was plotted. Interaction plot calculates the joint influence of two or more factors on the response [6].The interaction effect between two factors are computed using the following equation: Interaction effect between two factors = 1 / 2 [effect of first factor on response at high level of second factor -effect of first factor on response at low level of second factor] or vice-versa (1) From the graphs in Figure . 1, all three graphs in (a), (b) and (c) intersects at a certain point.…”

Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder

“…In telecommunication industry, some development is needed in the electronic, mechanical and functionality part. [1,[3][4]. The quality of the devices includes durability, performance and structural of the electronic packages.…”

“…The shear test on Ball Grid Array (BGA) has been widely adapted to examine the solder joint capability of a single solder ball in BGA packages [4][5][6][7][8][9][10][11][12][13]. The solder ball joint for the proper of high speed shearing is listed in the Joint Electronic Device Engineering Council (JEDEC) solder ball shear test specs, JESD22-B117, on October 2006 the specification code to be JESD22-B117A was renewed with a addition of 'A' at the end [14].…”

Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method

“…Ball shear test is the most popular technique used to evaluate the reliability of bond strength for ball grid array (BGA) packages [2][3][4][5][6][7][8][9]. The solder ball joint for the sufficient of high speed shearing refers to the standard of Joint Electronic Device Engineering Council (JEDEC).…”