Shear strength and interfacial microstructures of low-Ag SAC/Cu and SAC-Bi-Ni/Cu solder joints

Liu, Yang; Sun, Fenglian; Zou, Pengfei

doi:10.1109/isapm.2011.6105696

Cited by 3 publications

(2 citation statements)

References 10 publications

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“…In nanoindentation test, Hardness (H) of the material could be decided by, Where P was the peak indentation load; A was the contact area for a perfect Berkovich tip was given as: 2 …”

Section: Nano-indentation Testmentioning

confidence: 99%

Study of creep performance of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu by nanoindentation

Yang

Sun

2013

2013 14th International Conference on Electronic Packaging Technology

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The creep performance of the lead-free solder joint Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu(SAC0705BiNi/Cu) was investigated and compared with that of the lead-free solder joint Sn3Ag0.5Cu/Cu(SAC305/Cu) after thermal shock by nanoindedtation. It was found that the indentation creep of SAC0705BiNi/Cu solder joint was lower than SAC305/Cu solder joint before and after thermal shock. The Creep rate sensitive index of SACBiNi/Cu solder joint was smaller than SAC305/Cu. The anti-creep property of SAC0705BiNi/Cu solder joint shows better than SAC305/Cu solder joint. The hardness of SAC0705BiNi/Cu was increased 5MPa after thermal shock, in contrast with SAC305/Cu decreased 19MPa. The results indicated that Bi and Ni additions could significantly improve hardness and elastic modulus of BGA solder joints. In addition, the elastic modulus of SAC0705BiNi/Cu solder joint decreased by 8.57%, while the elastic modulus of SAC305/Cu reduced by 28.92%, it shows Bi and Ni could block the generation of defects. Results shows that adding Bi and Ni elements into low-Ag solders have notable effort to improve the creep resistance.

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“…In nanoindentation test, Hardness (H) of the material could be decided by, Where P was the peak indentation load; A was the contact area for a perfect Berkovich tip was given as: 2 …”

Section: Nano-indentation Testmentioning

confidence: 99%

Study of creep performance of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu by nanoindentation

Yang

Sun

2013

2013 14th International Conference on Electronic Packaging Technology

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“…One of the most widely used lead-free solder alloy types are the Sn-Ag-Cu (SAC) ternaries [7][8][9]. One of the development trends of the SAC alloys is tend to the lower silver content to reduce the market prize [10][11][12]. So, instead of the high Ag content so called micro-alloyed elements were applied such as: Ni, Co, Fe, Sb, etc.…”

Section: Introductionmentioning

confidence: 99%

Reliability Tests on SAC-xMn Solder Alloys

Szurdan

Medgyes

Mende

et al. 2019

2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Different Sn based micro-alloyed solder alloys with manganese content were developed for the electronic industry as a possible cost-effective candidates. The commonly used SnAg3Cu0.5 (SAC305) lead-free solder alloy applied as a reference. As a first step, various technological parameters tested from the solder alloy-manufacturing point of view. During the reliability investigations of the solder alloys, Vickers hardness, tensile strength and shear force tests were carried out. The results show that Mn content SAC alloys are useful in the electronics technology especially in those fields, where the high reliability is not required.

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