Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics

Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles

“…A large number of research and review papers described the impact of dopants on the microstructure and physical properties of SAC solders in the liquid and/or solid state [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20]. It was shown that minor insertions of additional elements modify the microstructure and improve different properties of SAC alloys.…”

“…Such structural changes improve both the microstructure and the mechanical properties such as microhardness and shear strength of doped SAC solders and their joints. However, it should be noted that in recent times the most popular way to reinforce SAC solders was the addition of ceramic nanoparticles into the SAC solder paste simply by mechanical mixing or by using the roll bonding procedure [12][13][14][15][16][17]. These minor (up to 1 wt%) additions of ceramic nanoparticles, such as Al 2 O 3 , TiO 2 , ZrO 2 , etc., improve the microstructure and mechanical properties of solder joints.…”

Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina

“…Chang [10] only took some simple observation of the interface microstructure and performed tests on the mechanical properties of the joints. Koleňák [11] only performed tests on the mechanical strength of the joints fabricated by ultrasonic activation in air, did not analyze the micro interface. So it is necessary to take in-depth research and analysis on the soldering alumina by SnAgTi filler.…”

Study of Direct Bonding of Ceramic and Metallic Materials with Zn4Al Solder

“…A nano-crystalline α-Al 2 O 3 layer (2 nm thick) was formed in the Sn-Zn-Al/sapphire boundary during soldering in the air at a temperature of 230°C. The shear strength of joints measured 43 to 48 MPa, which is a relatively high value when compared to other Al 2 O 3 ceramic joints fabricated with active Sn solders and the addition of Ti and/or lanthanides [3,4,5].…”

“…For example in study [3], the Al 2 O 3 /Sn-Ag-Ti/Al 2 O 3 bond showed a shear strength of 24 MPa. In work [4], the following strengths were achieved by soldering: Cu/Cu (14.3MPa), ITO/ITO (6.8 MPa) and ITO/Cu (3.4 MPa).…”