“…The interface morphology is changed by the continuous motion of Cu atoms and Sn atoms to reduce the interfacial energy and keep IMCs in a relatively stable state. Figure 14 shows the IMCs thickness of Sn–58Bi and Sn–Bi–0.25Mo solder joint aged at 110°C for different aging times, and the IMCs thickness is increased with increasing aging time due to the precipitation of Cu 3 Sn and Cu 6 Sn 5 compounds [37]. Figure 14 Effect of aging time on the IMCs thickness of Sn–58Bi and Sn–Bi–0.25Mo solder joints.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, IMCs layer becomes smooth and continuous with increasing aging time and IMCs layer morphology of Sn-58Bi-0.25Mo solder joint is changed from scallop-like to flat with increasing aging time, as shown in Figure 13(b,d,f). Cu 6 Sn 5 and Cu 3 Sn compounds are formed along the solder/Cu interface Figure 14 shows the IMCs thickness of Sn-58Bi and Sn-Bi-0.25Mo solder joint aged at 110°C for different aging times, and the IMCs thickness is increased with increasing aging time due to the precipitation of Cu 3 Sn and Cu 6 Sn 5 compounds [37].…”
The effect of Mo nanoparticles on the microstructure, wettability and mechanical properties of Sn–58Bi– xMo ( x = 0–2.00) solder joints was investigated. The results showed that the optimal wettability of Sn–58Bi–0.25Mo solder was obtained and the microstructure was refined by adding small amounts of Mo. The intermetallic compounds (IMCs) thickness was increased from Sn–58Bi 2.17 µm to Sn–58Bi–2Mo 2.73 µm. The tensile strength of Sn–58Bi solder joint was improved by adding 0.25 wt-% Mo. The fracture mode of Sn–58Bi solder joint and Sn–58Bi–0.25Mo solder joint was brittle fracture and the mixed mode was ductile failure and brittle fracture, respectively. The microstructure of Sn–58Bi and Sn–58Bi–0.25Mo solder joints was coarsened, IMCs thickness was increased and the mechanical properties were deteriorated with increasing aging time.
“…The interface morphology is changed by the continuous motion of Cu atoms and Sn atoms to reduce the interfacial energy and keep IMCs in a relatively stable state. Figure 14 shows the IMCs thickness of Sn–58Bi and Sn–Bi–0.25Mo solder joint aged at 110°C for different aging times, and the IMCs thickness is increased with increasing aging time due to the precipitation of Cu 3 Sn and Cu 6 Sn 5 compounds [37]. Figure 14 Effect of aging time on the IMCs thickness of Sn–58Bi and Sn–Bi–0.25Mo solder joints.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, IMCs layer becomes smooth and continuous with increasing aging time and IMCs layer morphology of Sn-58Bi-0.25Mo solder joint is changed from scallop-like to flat with increasing aging time, as shown in Figure 13(b,d,f). Cu 6 Sn 5 and Cu 3 Sn compounds are formed along the solder/Cu interface Figure 14 shows the IMCs thickness of Sn-58Bi and Sn-Bi-0.25Mo solder joint aged at 110°C for different aging times, and the IMCs thickness is increased with increasing aging time due to the precipitation of Cu 3 Sn and Cu 6 Sn 5 compounds [37].…”
The effect of Mo nanoparticles on the microstructure, wettability and mechanical properties of Sn–58Bi– xMo ( x = 0–2.00) solder joints was investigated. The results showed that the optimal wettability of Sn–58Bi–0.25Mo solder was obtained and the microstructure was refined by adding small amounts of Mo. The intermetallic compounds (IMCs) thickness was increased from Sn–58Bi 2.17 µm to Sn–58Bi–2Mo 2.73 µm. The tensile strength of Sn–58Bi solder joint was improved by adding 0.25 wt-% Mo. The fracture mode of Sn–58Bi solder joint and Sn–58Bi–0.25Mo solder joint was brittle fracture and the mixed mode was ductile failure and brittle fracture, respectively. The microstructure of Sn–58Bi and Sn–58Bi–0.25Mo solder joints was coarsened, IMCs thickness was increased and the mechanical properties were deteriorated with increasing aging time.
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