Shear test for adhesion measurement of small structures

Schammler, G.; Buschick, K.; Hahn, Raymond H.; Reichl, H.

doi:10.1109/irws.1996.583379

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Introduction1

Adhesion Strength Measurement1

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Cited by 6 publications

(2 citation statements)

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“…Shear test analysis is very popular in the industry to evaluate the adhesion strength of components and joints in microelectronic packages [3]. Although such tests are relatively simple, fast and inexpensive to implement, there is not much knowledge to interpret the testing results.…”

Section: Introductionmentioning

confidence: 99%

Characterization and FE analysis on the shear test of electronic materials

Gonzalez

Vandevelde

Hoof

et al. 2004

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 99%

Characterization and FE analysis on the shear test of electronic materials

Gonzalez

Vandevelde

Hoof

et al. 2004

Microelectronics Reliability

View full text Add to dashboard Cite

“…However, there are limited reports [108][109] on the study of the evolution of the adhesion strength during the curing process. Due to the difficulty in controlling the shear height [110] that could affect the shear force and the premature fracture caused by the possible bending of the Substrates used for the adhesion test were made up of bismaleimide triazine (BT) epoxy, 0.03 urn electroless Au, and standard Ball Grid Array (BGA) solder mask materials.…”

Section: Adhesion Strength Measurementmentioning

confidence: 99%