There is a growing demand for single-use disposable polymer devices with features at submicron scales. This requires resilient tooling which can be patterned to scales of the order of hundreds of nm. The requisite topology can be imparted to silicon but it is too brittle to be of use in a die to mold thousands of plastic parts. The polycrystalline nature of tool steel means it cannot be patterned with sub-micron detail. Some bulk amorphous alloys have the requisite mechanical properties to be viable as materials for such dies, and can be patterned -e.g. via embossing as a supercooled liquid into MEMS silicon or using FIB -with sub-micron features which may persevere over many thousands of molding cycles. The composition of the amorphous alloy must be carefully selected to suit the particular molding application (polymer/process). The state-of-the-art of is presented, along with results of our recent experimental investigations.