Solution‐processed NiOx thin films have been applied as hole‐injection layers (HILs) in quantum‐dot light‐emitting diodes (QLEDs). The commonly used NiOx HILs are prepared by the precursor‐based route, which requires high annealing temperatures of over 275 °C to in situ convert the precursors into oxide films. Such high processing temperatures of NiOx HILs hinder their applications in flexible devices. Herein, we report a low‐temperature approach based on Cu‐modified NiOx (NiOx‐Cu) nanocrystals to prepare HILs. A simple post‐synthetic surface‐modification step, which anchors the copper agents onto the surfaces of oxide nanocrystals, is developed to improve the electrical conductivity of the low‐temperature‐processed (135 °C) oxide‐nanocrystal thin films. In consequence, QLEDs based on the NiOx‐Cu HILs exhibit an external quantum efficiency of 17.5 % and a T95 operational lifetime of ∼2,800 h at an initial brightness of 1,000 cd m−2, meeting the commercialization requirements for display applications. The results shed light on the potential of using NiOx‐Cu HILs for realizing high‐performance flexible QLEDs.