A set of MOS capacitors with TiOxNy films as gate dielectric layer was fabricated and characterized. The TiOxNy films were deposited by reactive r.f. magnetron sputtering varying the nitrogen and oxygen partial pressure in a Ar/N2/O2 gaseous mixture.The TiOxNy films were characterized by, Rutherford Backscattering (RBS), X‐ray absorption near edge spectroscopy (XANES) in oxygen K‐edge (O‐K), optical absorption and High Resolution Transmission Electron Microscopy (HRTEM). Capacitance‐voltage (1MHz) and current‐voltage measurements were performed to obtain the effective dielectric constant, the effective oxide thickness (EOT), the leakage current density, and the interface quality. MOS capacitors results show that the TiOxNyfilms dielectric constant varies from 28 to 80, present a good interface quality with silicon, and the leakage current density values are in the order of 0.25 mA/cm2 for VG = –2V, which is acceptable for high performance logic circuits and low power circuits fabrication. The leakage current density is reduced in 2 orders of magnitude for increasing nitrogen concentration (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)