1990
DOI: 10.1063/1.1141166
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Si wafers uniformly spaced; bonding and diagnostics

Abstract: A new Si-Si0 2 bonding process has been developed to achieve a uniform spacing between two silicon wafers of 2 and 3 in. diam. Spacings between 0.1 and 3.9 11m have been obtained so far. Hydrostatic pressure is used to force the two wafers into intimate contact at points where bonding is desired. The bonding is performed at a temperature of -1150 0c. The uniformity of bonding and spacing between the wafers is checked by a Fabry-Perot interferometer technique at room temperature and by measurements of superflui… Show more

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Cited by 34 publications
(20 citation statements)
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“…These two wafers are bonded together using direct wafer bonding [10,11]. This improves our earlier protocol [12], and is much more reliable. Diagnostics of the bonding quality include infrared (IR) imaging and IR interference experiments [11,12].…”
Section: Sarabjit Mehta and Francis M Gasparinimentioning
confidence: 93%
“…These two wafers are bonded together using direct wafer bonding [10,11]. This improves our earlier protocol [12], and is much more reliable. Diagnostics of the bonding quality include infrared (IR) imaging and IR interference experiments [11,12].…”
Section: Sarabjit Mehta and Francis M Gasparinimentioning
confidence: 93%
“…Faced with these requirements, a decision to move away from the use of Si-SiO 2 bonding as described by Rhee et al 9 was taken. This was based on anecdotal information about the strength of the Si-SiO 2 bond and the requirement to avoid numerous supporting posts.…”
Section: Introductionmentioning
confidence: 99%
“…The centre of the top wafer has a series of 8-mm-long, 15-µm-wide channels that take the helium from the centre filling hole to the rest of the cell. The cell is formed by direct wafer bonding 15 . The resulting structure is an array of boxes spaced 6 µm centre to centre and connected through a planar opening 31.7 nm high.…”
Section: Figure 1 | the Confinement Cellmentioning
confidence: 99%