2012
DOI: 10.1016/j.physb.2011.09.063
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SiC epitaxy growth using chloride-based CVD

Abstract: The growth of thick epitaxial SiC layers needed for high-voltage, high-power devices is investigated with the chloride-based chemical vapor deposition. High growth rates exceeding 100 µm/h can be obtained, however to obtain device quality epilayers adjustments of the process parameters should be carried out appropriately for the chemistry used. Two different chemistry approaches are compared: addition of hydrogen chloride to the standard precursors or using methyltrichlorosilane, a molecule that contains silic… Show more

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Cited by 18 publications
(11 citation statements)
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“…This decrease is similar to what has been observed for chlorinated SiC CVD. 22,23 After the growth rate increase, at the same position as the growth rate reaches its maximum, the growth also becomes epitaxial. This transition to epitaxial growth is such abrupt that the position for it is easily recognized.…”
Section: Resultsmentioning
confidence: 99%
“…This decrease is similar to what has been observed for chlorinated SiC CVD. 22,23 After the growth rate increase, at the same position as the growth rate reaches its maximum, the growth also becomes epitaxial. This transition to epitaxial growth is such abrupt that the position for it is easily recognized.…”
Section: Resultsmentioning
confidence: 99%
“…Normally, the gases are forced through the rectangular opening using a quartz liner, which gives good utilization of the gases. 35 This type of reactor was a significant step forward in terms of producing high quality material. The material was of substantially better morphology, with a lower background doping, in the low 10 13 cm À3 range, and thicknesses greater than 50 lm could readily be grown.…”
Section: A Evolution Of Reactorsmentioning
confidence: 99%
“…Chloride-based chemistry has been shown to significantly improve the epitaxial growth rate to over 100 μm h À1 . [4][5][6][7][8] Using 4 offcut substrates, basal plane dislocations (BPDs) have shown to reduce to less than 0.1 cm À2 and similar improvements have been made regarding other epitaxial defects such as triangular defects, in-grown stacking faults (SFs), [9] and other intrinsic defects detrimental for high-power bipolar devices. [10][11][12][13][14] Considerable improvements in the on-axis homoepitaxy on the Si face of 100 mmdiameter wafers have also shown [15] to be an alternative route to obtain thick epilayers free of BPDs that are highly suitable for high-power bipolar devices.…”
Section: Introductionmentioning
confidence: 99%