2006
DOI: 10.4028/www.scientific.net/msf.527-529.107
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SiC HTCVD Simulation Modified by Sublimation Etching

Abstract: High temperature chemical vapor deposition (HTCVD) simulations of silicon carbide (SiC) were demonstrated with experimental results. A vertical cylindrical reactor was used in an RF inductive heating furnace and the temperature was more than 2200. SiH4 and C3H8 were used as source gases and H2 as carrier gas. A gas phase reaction model from the literature was used on the condition that the gas phase reaction is a quasi-equilibrium state. It was found that the major species were Si, Si2C, SiC2 and C2H2 in the g… Show more

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Cited by 20 publications
(13 citation statements)
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“…The surface-covering graphene sheet certainly obstructs Si sublimation away from the substrate surface [47,48]. Since perfect graphene sheets only have small six-member C rings, any Si atom has difficulty passing through the sheet.…”
Section: The Role Of Steps In Epitaxial Graphene Growthmentioning
confidence: 99%
“…The surface-covering graphene sheet certainly obstructs Si sublimation away from the substrate surface [47,48]. Since perfect graphene sheets only have small six-member C rings, any Si atom has difficulty passing through the sheet.…”
Section: The Role Of Steps In Epitaxial Graphene Growthmentioning
confidence: 99%
“…The growth rate can be simplified in the formula of GR £ DC 0 /¤ when the partial pressure of the gas species is much higher than the equilibrium vapor pressure between solid SiC and the gas phase, where GR is the growth rate, D is the diffusion coefficient of the gas species, C 0 is the density of the gas species outside of the boundary layer and ¤ is the boundary layer thickness. 18) When no homogeneous nucleation of the precursors takes place in the gas phase, C 0 is proportional to the system pressure (P) and the product of DC 0 is unchanged by varying P under the constant mass flow rates, since D is inversely proportional to P. In this case, GR is inversely proportional to ¤. In the case of a general gas flow, ¤ over a flat plane is proportional to [®/(Uμ)] 1/2 , where U is the general gas flow speed out of the boundary layer, μ is the gas density and ® is the viscosity.…”
mentioning
confidence: 99%
“…The temperature of the gas-cracking zone and the walls should be slightly higher than that of the seed crystal, to ensure mass transport and condensation on the seed. The typical growth pressures and growth rates are 25-80 kPa and 0.3-1.5 mm/h, respectively [82][83][84].…”
Section: High-temperature Chemical Vapor Depositionmentioning
confidence: 99%