SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment

Abstract

In order to take full advantage of SiC, a high temperature wirebond package for multi-chip phase-leg power module using SiC devices was designed, developed, fabricated and tested. The details of the material selection and thermo-mechanical reliability evaluation are described. High temperature power test shows that the package presented in this paper can perform well at the high junction temperature.

Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronics

“…For example, for several years, works for the integration of SiC components in avionic equipment's were conducted in collaboration with Safran group [1,2]. Lot of works had been done on performance of SiC components themselves, their strength against electric stressful regimes such as short-circuits and avalanches [3,4].…”