Handbook of RF and Wireless Technologies 2004
DOI: 10.1016/b978-075067695-3/50017-3
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SiGe HBT Technology for RF and Wireless Applications

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“…R C is the collector resistance, V t is the thermal voltage, and t scl, t em and t qbe are the delay terms associated with the base-collector space-charge layer, charge in the emitter and free carrier charge in the emitter-base space-charge layer, respectively. The high-frequency minimum noise value NF MIN of a bipolar transistor is given as [10,11],…”
Section: Theory and Simulation Methodologymentioning
confidence: 99%
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“…R C is the collector resistance, V t is the thermal voltage, and t scl, t em and t qbe are the delay terms associated with the base-collector space-charge layer, charge in the emitter and free carrier charge in the emitter-base space-charge layer, respectively. The high-frequency minimum noise value NF MIN of a bipolar transistor is given as [10,11],…”
Section: Theory and Simulation Methodologymentioning
confidence: 99%
“…The contribution of the second and third term in the brackets of equation (11) contributes in the electric field E(x) due to the gradient of the base doping and non-uniform band-gap narrowing effect, respectively. However, at high injection levels the field variation in the base due to minority carrier concentration gradient (first term in the brackets) is the dominant component of the electric field in the base.…”
Section: Theory and Simulation Methodologymentioning
confidence: 99%