This article presents a detailed design example of applying envelope tracking (ET) techniques on a highly monolithic silicon‐based radio‐frequency (RF) power amplifier (PA) to form a high‐efficiency and low‐cost ET‐PA system. An envelope‐tracked SiGe cascode PA with an integrated complementary metal–oxide–semiconductor (CMOS) envelope modulator for mobile WiMAX and 3GPP long‐term evolution (LTE) transmitters (TXs) is shown in this work. The entire ET‐based RF PA system delivers the linear output power of 22.3/24.3 dBm with the overall power‐added efficiency (PAE) of 33%/42% at 2.4 GHz for the WiMAX 64QAM and the 3GPP LTE 16QAM modulations, respectively. Additionally, it exhibits a highly efficient broadband characteristic for multiband applications. Compared with the conventional fixed‐supply cascode PA, our ET‐based cascode PA meets the WiMAX/LTE spectral mask and error vector magnitude (EVM) spec at close to its
P
1dB
compression without the need for predistortion. The SiGe PA and the CMOS envelope modulator are both designed and fabricated in the TSMC 0.35‐μm SiGe bipolar CMOS (BiCMOS) process on the same die. This work represents an essential integration step toward achieving a fully monolithic ET‐based TX for wideband wireless applications.