Signal integrity analysis of simultaneous switching noises and decoupling capacitors in digital packages and PCB systems

Yuan, F.Y.

doi:10.1109/epep.1996.564807

Cited by 3 publications

References 5 publications

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Application of system-level EM modeling to high-speed digital IC packages and PCBs

Yook

Katehi

Sakallah

et al. 1997

IEEE Trans. Microwave Theory Techn.

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A system-level electromagnetic (EM) modeling tool combining a three-dimensional (3-D) full-wave finite-element EMfield analysis tool and a time-domain electric-circuit simulator is developed and applied to various geometries such as multilayer printed circuit boards (PCB's), signal lines embedded in a PCB or package, and split power-distribution network. Since the signal integrity is a primary concern of high-speed digital circuits, the noise distributions on various circuit planes are evaluated from the analysis. These noise distributions, often called noice maps, are utilized to identify the location of the major source of simultaneous switching noise (SSN). This information can eventually be adapted for optimum placement of decoupling capacitors to minimize the noise fluctuations on the various circuit planes on an entire PCB.

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