Significant enhancement of the strength-to-resistivity ratio by nanotwins in epitaxial Cu films

Anderoglu, Osman; Misra, Amit; Ronning, F.; Wang, H.; Zhang, X.

doi:10.1063/1.3176483

Cited by 59 publications

(33 citation statements)

References 52 publications

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“…These microstructural characteristics are desirable, and believed to be essential in reducing thermo-mechanical stresses in multi-material systems such as microelectronic interconnects without degrading electrical properties of the material. 6,7,9,28,29 …”

Section: Methodsmentioning

confidence: 99%

The Impact of Organic Additives on Copper Trench Microstructure

Marro

Okoro

Obeng

et al. 2017

J. Electrochem. Soc.

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Organic additives are typically used in the pulse electrodeposition of copper (Cu) to prevent void formation during the filling of high aspect ratio features. In this work, the role of bath chemistry as modified by organic additives was investigated for its effects on Cu trench microstructure. Polyethylene glycol (PEG), bis(3-sulfopropyl) disulfide (SPS), and Janus green b (JGB) concentrations were varied in the Cu electrodeposition bath. Results indicated a correlation between the JGB/SPS ratio and the surface roughness and residual stresses in the Cu. Electron backscattering diffraction (EBSD) and transmission Kikuchi diffraction (TKD) were used to study the cross-sectional microstructure in the trenches. Finer grain morphologies appeared in trenches filled with organic additives as compared to additive-free structures. Cu trench (111) texture also decreased with increasing organic additive concentrations due to more pronounced influence of sidewall seed layers on trench features. Twin density in the microstructure closely tracked calculated stresses in the Cu trenches. A comprehensive microstructural analysis was conducted in this study, on an area of focus that has garnered little attention from the literature, yet can have a major impact on microelectronic reliability.

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Section: Methodsmentioning

confidence: 99%

The Impact of Organic Additives on Copper Trench Microstructure

Marro

Okoro

Obeng

et al. 2017

J. Electrochem. Soc.

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“…With the optimization of the manageable aspects, NT materials can simultaneously exhibit high strength and good ductility, the characteristics that are thought to be mutually exclusive. Besides, they also display high-performance on electrical conductivity 37,49 and thermal stability etc. [158][159][160] Thus, the development of synthesis techniques for growth NT structures in metals is increasingly a fascinating issue.…”

Section: -151mentioning

confidence: 99%

“…NT materials have attracted worldwide attention due to the favorable mechanical and physical properties. Experimental studies have uncovered that NT metals have ultrahigh strength/hardness, 24,25,38,[48][49][50] good ductility 25,51,52 and great strain hardening. 25,51,53 Corresponding to these experimental outcomes, a large quantity of theoretical studies are available, such as the intrinsic size effects and plastic anisotropy, the stability of NT structures, 54,55 the effect of surface stress 56,57 and NT structures in CG system on the mechanical properties of metals.…”

Section: Introductionmentioning

confidence: 99%

Nanotwinned and hierarchical nanotwinned metals: a review of experimental, computational and theoretical efforts

Sun

2018

npj Comput Mater

134

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The recent studies on nanotwinned (NT) and hierarchical nanotwinned (HNT) face-centered cubic (FCC) metals are presented in this review. The HNT structures have been supposed as a kind of novel structure to bring about higher strength/ductility than NT counterparts in crystalline materials. We primarily focus on the recent developments of the experimental, atomistic and theoretical studies on the NT and HNT structures in the metallic materials. Some advanced bottom-up and top-down techniques for the fabrication of NT and HNT structures are introduced. The deformation induced HNT structures are available by virtue of severe plastic deformation (SPD) based techniques while the synthesis of growth HNT structures is so far almost unavailable. In addition, some representative molecular dynamics (MD) studies on the NT and HNT FCC metals unveil that the nanoscale effects such as twin spacing, grain size and plastic anisotropy greatly alter the performance of NT and HNT metals. The HNT structures may initiate unique phenomena in comparison with the NT ones. Furthermore, based on the phenomena and mechanisms revealed by experimental and MD simulation observations, a series of theoretical models have been proposed. They are effective to describe the mechanical behaviors of NT and HNT metals within the applicable scope. So far the development of manufacturing technologies of HNT structures, as well as the studies on the effects of HNT structures on the properties of metals are still in its infancy. Further exploration is required to promote the design of advanced materials.

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“…From extensive studies of twinned crystals, metals containing nano-twinned structures have an attractive combination of properties such as high yield strength and ductility [4,5], high electrical conductivity [4,6] and excellent thermal stability [7,8]. In general, two types of TBs exist in polycrystalline fcc metals, CTBs and ITBs, that may interact differently with defects during plastic deformation.…”

Section: Introductionmentioning

confidence: 99%

Structure and stability of Σ3 grain boundaries in face centered cubic metals

Wang

Misra

2013

Philosophical Magazine

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AE3 grain boundaries form as a result of either growth twinning or deformation twinning in face centered cubic (fcc) metals and play a crucial role in determining the mechanical and electrical properties and microstructural stability. We studied the structure and stability of AE3 grain boundaries (GBs) in fcc metals by using topological analysis and atomistic simulations. Atomistic simulations were performed for Cu and Al with empirical interatomic potentials to reveal the influence of stacking fault energy on the morphology of the twinned grains. Three sets of tilt AE3 GBs were studied with respect to the tilt axis parallel to h111i, h112i, and h110i, respectively. We showed that AE3{111} and AE3{112} GBs are thermodynamically stable and the others will dissociate into terraced interfaces regardless of the stacking fault energy. The morphology of the nanotwinned grains in Cu is predicted from the above analysis and found to match with experiments.

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Significant enhancement of the strength-to-resistivity ratio by nanotwins in epitaxial Cu films

Cited by 59 publications

References 52 publications

The Impact of Organic Additives on Copper Trench Microstructure

The Impact of Organic Additives on Copper Trench Microstructure

Nanotwinned and hierarchical nanotwinned metals: a review of experimental, computational and theoretical efforts

Structure and stability of Σ3 grain boundaries in face centered cubic metals

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