Silicon-Based Suspended Structure Fabricated by Femtosecond Laser Direct Writing and Wet Etching

Ma, Yuncheng; Wang, Lei; Guan, Kai-Min; Jiang, Tong; Cao, Xiaoyuan; Chen, Qi‐Dai; Sun, Hong–Bo

doi:10.1109/lpt.2016.2554203

Cited by 18 publications

(7 citation statements)

References 22 publications

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“…In addition, it has been demonstrated that semiconductors and metals could be oxidized by laser ablation in air 59,62,63 . Due to the difference of etching rate between silicon and silica, complex three-dimensional microstructures, even suspended microstructures, can be fabricated on these materials 63,64 . In addition, based on the laser induced redox reactions, metal nanoparticles (Au and Ag) can be directly reduced from ion stage in phosphate glasses, silica matrix and soda-lime glass 60,61 .…”

Section: Component Changementioning

confidence: 99%

“…For example, by using temporally shaped femtosecond laser, the energy deposition efficiency can be improved by adjusting the pulse delay to yield a stronger material modification, which helps to increase the etching selectivity 74 . In addition, by using different etching solutions 64,75 , more complex structures can by realized. The mostly used photosensitive glass is Foturan glass, which consists of lithium aluminosilicate glass with doping by a small amount of silver ions and cerium ions.…”

Section: Wet-etching-assisted Femtosecond Laser Modificationmentioning

confidence: 99%

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Etching-assisted femtosecond laser modification of hard materials

Liu

Bai

Chen

et al. 2019

Opto-Electronic Advances

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With high hardness, high thermal and chemical stability and excellent optical performance, hard materials exhibit great potential applications in various fields, especially in harsh conditions. Femtosecond laser ablation has the capability to fabricate three-dimensional micro/nanostructures in hard materials. However, the low efficiency, low precision and high surface roughness are the main stumbling blocks for femtosecond laser processing of hard materials. So far, etching-assisted femtosecond laser modification has demonstrated to be the efficient strategy to solve the above problems when processing hard materials, including wet etching and dry etching. In this review, femtosecond laser modification that would influence the etching selectivity is introduced. The fundamental and recent applications of the two kinds of etching assisted femtosecond laser modification technologies are summarized. In addition, the challenges and application prospects of these technologies are discussed.

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Section: Component Changementioning

confidence: 99%

Section: Wet-etching-assisted Femtosecond Laser Modificationmentioning

confidence: 99%

Etching-assisted femtosecond laser modification of hard materials

Liu

Bai

Chen

et al. 2019

Opto-Electronic Advances

Self Cite

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“…At present, the fabrication of nano-molds mainly relies on high energy beam direct writing or highresolution exposure technology. The high energy beam direct writing uses focused ion beam [20,32], electron beam [33,34], laser beam [35,36] and other nano-scale resolution equipment to etch nano-structures (<10 nm) on the substrates, which is time-consuming and costly. High-resolution exposure techniques such as x-ray exposure [37,38], and deep ultraviolet exposure [39,40] can fabricate nano-structures sub 100 nm, which requires expensive nano-photomask plates and exposure equipment.…”

Section: Introductionmentioning

confidence: 99%

A low-cost fabrication method for high aspect ratio nano-channels by near-field UV exposure and thermal nanoimprinting

Zhang

Sun

2023

J. Micromech. Microeng.

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A low-cost fabrication method for high aspect ratio nano-channels is proposed in this paper. The near-field exposure principle based on Fresnel diffraction was analyzed and the silicon nano-mold with the height of 962±9 nm and width of 332±12 nm was produced. Furthermore, the applicable demolding conditions for high aspect ratio nanoimprinting were studied, and the SU-8 nano-channels with the height of 947±17 nm and width of 336±13 nm were fabricated.

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“…In recent years, different fabrication methods of nanostructures have been reported. By using proton beam [17][18][19], electron beam [20][21][22], focused ion beam [23][24][25] and femtosecond laser [26][27][28], nanostructure patterns can be directly written on the surface of the substrate. These methods can be used to fabricate high-precision nanostructures, but with the requirement of expensive equipment and the processing time consuming.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of 2D silicon nano-mold by side etch lift-off method

Guo

et al. 2021

Nanotechnology

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Nano-imprint technology is a method of nano-pattern reproduction, has the characteristics of high resolution, high throughput, and low-cost. It can reduce the complexity and cost of the equipment while improving the resolution, which considered a promising industrial production technology. The key to nanoimprinting lies in the mold, and the quality of the mold directly determines the quality of the imprinted graphics. Here, a method for fabricating sub-100 nm concave 2D silicon nano-mold by side etch lift-off is proposed. The effects of different wet etching time and the metal deposition angle on the width of nanochannels were studied. The measurement result of dry etching shows that on the entire 4 inch silicon wafer, the width of the nanochannel varies by 4% and the depth by 2%. The width of the nanochannel between chips varies by 0.7%, and the depth variation is 1%. With this new method, high-precision and large-scale silicon nano-mold can be produced, which has great potential for realizing high-precision and low-cost manufacturing of nano devices.

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Silicon-Based Suspended Structure Fabricated by Femtosecond Laser Direct Writing and Wet Etching

Cited by 18 publications

References 22 publications

Etching-assisted femtosecond laser modification of hard materials

Etching-assisted femtosecond laser modification of hard materials

A low-cost fabrication method for high aspect ratio nano-channels by near-field UV exposure and thermal nanoimprinting

Fabrication of 2D silicon nano-mold by side etch lift-off method

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