“…6 So far, chemical vapor deposition (CVD), physical vapor deposition (PVD), molecular beam epitaxy, sputtering, or laser ablation have been successfully employed to deposit SiC coatings on substrates. [3][4][5][6] However, these methods, based on relatively expensive equipment and time-consuming procedures, are not always practical or cost-efficient. It has been generally reported that the formation of voids and defects are observed at the SiC/substrate interface in the initial stage of the growth, which leads to serious problems in the realization of SiC MEMS devices.…”