Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration

Fischer, M.; Gropp, S.; Stegner, J.; Frank, A.; Hoffmann, Martin; Mueller, Jens

doi:10.1109/mmm.2019.2928675

Cited by 6 publications

(7 citation statements)

References 23 publications

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“…The later interface side is structured by etching with Potassium hydroxide solution (KOH) to generate 800 µm x 800 µm cavities with a membrane thickness of around 50 µm (3). Black silicon can be applied additionally onto the interface-side to enhance the bond strength [6]. To improve wetting [7] of the bondinterface a ~25 nm titanium is applied on the Si-wafer and thermally oxidized to ~50 nm thick titanium oxide.…”

Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

“…To improve wetting [7] of the bondinterface a ~25 nm titanium is applied on the Si-wafer and thermally oxidized to ~50 nm thick titanium oxide. [4], [6] The LTCC process begins with cutting the tape in the required processable size (115 mm x 115 mm) with consideration of the casting direction. This is necessary to compensate the casting direction related shrinkage deviation.…”

Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

“…For the pressure sensor, 4 ceramic double tapes are necessary to create the channel structure. The cavities in the double tapes are punched in accordance with the respective layout (6). If required further pre-processing steps like screen-printing, via filling or laser structuring can be carried out.…”

Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

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Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Kleinholz,

Fischer,

Gutzeit

et al. 2024

IMAPSource Proceedings

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A variety of manufacturing methods can be used to assemble silicon-based piezoresistive pressure sensors, such as anodic bonding or silicon direct bonding. To achieve highstrength pressure sensors, a high quality interface connection is required. The combination of silicon and ceramic creates a new innovative composite system known as Silicon-on-Ceramics, short SiCer. By using a special developed bondable Low Temperature Co-fired Ceramic tape, which corresponds to the thermal expansion coefficient of Si, the combination of both materials is possible through a sintering process. Advantages of the SiCer technology are high temperature stability, manufacturing at wafer-level and a high bond strength at the interface. Different manufactured SiCer-based pressure sensors were fabricated, electrically and mechanically characterized and compared with anodic bonded and silicon direct bonded pressure sensors.

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Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

Section: A Previous Manufacturing Methodsmentioning

confidence: 99%

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Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Kleinholz,

Fischer,

Gutzeit

et al. 2024

IMAPSource Proceedings

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“…Thermal bonding of silicon and LTCC at sintering temperatures of 900 • C represents currently the standard process in silicon-ceramic composite (SiCer) substrate fabrication [3]. A quasi-monolithic SiCer substrate can be made by co-sintering of LTCC and silicon while basic functionalities regarding electrical connections from LTCC to silicon can be implemented using through silicon vias [4,5].…”

Section: Introductionmentioning

confidence: 99%

“…Due to the initially required relatively high sintering pressures in the range of 800 kPa, investigations on wetting promoting layers were triggered to lower the required pressure. Intermediate TiO 2 thin layers appear, for instance, to reduce the needed sintering pressure dramatically [6] leading the so-called pressureassisted sintering with pressure of as low as 3 kPa [3]. The benefits of SiCer substrates are, for instance, demonstrated in radio frequency micro-electro-mechanical systems (RF-MEMS) applications [2,7].…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis of the ceramic material and evaluation of the bonding behavior of silicon-ceramic composite substrates

Mohr-Weidenfeller

Kleinholz

Müller

et al. 2022

J. Micromech. Microeng.

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Thermal bonding of silicon and low-temperature cofired ceramics (LTCC) at sintering temperatures of 900 °C represents currently the standard process in silicon-ceramic composite substrate (SiCer) fabrication. We analyse the thermal behavior of the LTCC using thermogravimetric analysis, differential scanning calorimetry and laser flash analysis. The thermal decomposition could be identified with a mass loss of 24 % in the temperature range up to 1000 °C what influences the thermal diffusivity with values from about 0.19 mm²/s before thermal treatment to below 0.10 mm²/s after thermal treatment. A specific heat capacity of 1 to 2 J/(g⋅K) is calculated. Further, an influence of low-temperature lamination of the LTCC seems to have an influence on the thermal behaviour. The sintering process was investigated with temperatures of 550 °C, 730 °C and 900 °C, applied pressures of 12.2 kPa and 6.1 kPa and intermediate wetting layers of TiO2 (normal deposition and oblique angle deposition). Optical observations, ultrasonic and scanning electron microscopy, and pull-tests are used to compare the properties of the sintered SiCer substrates. Whereas the sintering temperature has an obvious impact on the sintering behaviour of the LTCC, a direct conclusion of parameter variation on the bonding result was not observed.

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A novel 2-in-1 heat management and recovery system for sustainable electronics

Jaziri,

Schulz,

Bartsch

et al. 2024

Energy Conversion and Management

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Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration

Cited by 6 publications

References 23 publications

Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods

Thermal analysis of the ceramic material and evaluation of the bonding behavior of silicon-ceramic composite substrates

A novel 2-in-1 heat management and recovery system for sustainable electronics

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