2006
DOI: 10.1557/mrs2006.160
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Silicon Surface Morphologies after Femtosecond Laser Irradiation

Abstract: In this article, we present summaries of the evolution of surface morphology resulting from the irradiation of single-crystal silicon with femtosecond laser pulses. In the first section, we discuss the development of micrometer-sized cones on a silicon surface irradiated with hundreds of femtosecond laser pulses in the presence of sulfur hexafluoride and other gases. We propose a general formation mechanism for the surface spikes. In the second section, we discuss the formation of blisters or bubbles at the in… Show more

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Cited by 165 publications
(115 citation statements)
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“…Generally, higher fluence was necessary to generate larger internal ablation pressure to delaminate and lift thicker films, but at the cost of creating larger diameter craters in the c-Si substrate. The observed fluence thresholds and the ablation crater diameters were nearly identical in SiO x films in comparison with SiN x films of the same thickness, and are in accord with the results reported for 147 nm SiO x films [13]. During KOH etching, the smallest ablation craters in 100 nm thick SiN x /SiO x films did not etch to form inverted-pyramids.…”
Section: Optimization Of the Texturing Processsupporting
confidence: 88%
See 1 more Smart Citation
“…Generally, higher fluence was necessary to generate larger internal ablation pressure to delaminate and lift thicker films, but at the cost of creating larger diameter craters in the c-Si substrate. The observed fluence thresholds and the ablation crater diameters were nearly identical in SiO x films in comparison with SiN x films of the same thickness, and are in accord with the results reported for 147 nm SiO x films [13]. During KOH etching, the smallest ablation craters in 100 nm thick SiN x /SiO x films did not etch to form inverted-pyramids.…”
Section: Optimization Of the Texturing Processsupporting
confidence: 88%
“…The technique enables inverted-pyramidal texturing of Si with flexible pattern designs, thus exploiting the low reflection, high diffractive light-trapping capability and passivation benefits of such texture. While femtosecond lasers have been used to texturize c-Si with chemical assistance [13], the produced 'black' silicon has significant structural damage that prevents passivation and decreases carrier lifetime. Alternatively, femtosecond lasers have been applied to SiO x thin films on c-Si to form micro-blisters [13,14] and induce catapulting which we extend to SiN x and further exploit here to form a high resolution hard mask for KOH etching.…”
Section: Introductionmentioning
confidence: 99%
“…2. It is suggested that growth is a dominant spike formation mechanism under nanosecond laser while ablation is dominant for femtosecond pulses [11].…”
Section: Surface Topography On Laser Irradiated A-si:hmentioning
confidence: 99%
“…Extensive work on surface texturing of crystalline bulk silicon had been reported by using both femtosecond and nanosecond laser [11,12]. Wang et al [13,14] and Nayak and Gupta [9] also achieved both surface texturing and crystallization on a-Si:H thin films by using femtosecond laser.…”
Section: Introductionmentioning
confidence: 99%
“…Studies have demonstrated that processing of materials using ultrafast laser pulses is a feasible route for the fabrication nanostructures with diverse materials [13]. Synthesis of crystalline silicon nanostructures using femtosecond laser pulses at KHz pulse repetition rate under vacuum in a gaseous environment is reported [14][15][16][17]. Recently a competent approach for increasing the rate of production and size reduction of silicon nanoparticles using femtosecond double-pulse laser ablation of silicon in ethanol is proposed [18].…”
Section: Introductionmentioning
confidence: 99%