2010
DOI: 10.1143/jjap.49.066701
|View full text |Cite
|
Sign up to set email alerts
|

Silicon Wafer Cleaning Using New Liquid Aerosol with Controlled Droplet Velocity and Size by Rotary Atomizer Method

Abstract: Numerical experiments on two-dimensional convection with or without a vertical magnetic field reveal a bewildering variety of periodic and aperiodic oscillations. Steady rolls can develop a shearing instability, in which rolls turning over in one direction grow at the expense of rolls turning over in the other, resulting in a net shear across the layer. As the temperature difference across the fluid is increased, two-dimensional pulsating waves occur, in which the direction of shear alternates. We analyse the … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
7
0

Year Published

2013
2013
2023
2023

Publication Types

Select...
5
3
2

Relationship

1
9

Authors

Journals

citations
Cited by 20 publications
(7 citation statements)
references
References 9 publications
0
7
0
Order By: Relevance
“…In this fine-controlled, dual-fluid system, DIW droplet velocity can be manipulated by flow rate, while the droplet size is controlled by the frequency of function generator connecting to the piezoelectric nozzle head. The velocity and size of droplets are controlled in the range of ±5% by verification with highspeed camera and scanning electron microscope (5).…”
Section: New Wet Clean Methods In Finfetmentioning
confidence: 99%
“…In this fine-controlled, dual-fluid system, DIW droplet velocity can be manipulated by flow rate, while the droplet size is controlled by the frequency of function generator connecting to the piezoelectric nozzle head. The velocity and size of droplets are controlled in the range of ±5% by verification with highspeed camera and scanning electron microscope (5).…”
Section: New Wet Clean Methods In Finfetmentioning
confidence: 99%
“…During laser cleaning technology, which uses the characteristics of the stain with strong laser absorption, stains instantaneous absorb a large amount of laser energy, forcing the separation of surface stains and silicon substrate. In the RCA cleaning method, silicon wafers are sequentially placed in a chemical reagent, such as a mixture of H 2 SO 4 and H 2 O 2 , HF, a combination of NH [22][23][24][25]. These cleaning methods have good effects, but the cleaning equipment is expensive.…”
Section: Introductionmentioning
confidence: 99%
“…In the manufacture of semiconductor chips, the cleaning process is an important process that determines the product yield [2][3][4]. One of the spray tools used in single-wafer cleaning is the twofluid spray, in which a stream of compressed gas, such as nitrogen gas, turns pure water into droplets that are sprayed onto the wafer [5]. However, two-fluid spray cleaning has the problem of ESD on devices on the wafer because the sprayed pure water becomes charged and the charged droplets land on the wafer surface [6].…”
Section: Introductionmentioning
confidence: 99%