Silver and silver–copper electrodeposition from a pyridinium-based ionic liquid

Reyna-González, Juan Manuel; Reyes-López, Juan C.; Aguilar-Martı́nez, Martha

doi:10.1016/j.electacta.2012.09.035

Cited by 36 publications

(34 citation statements)

References 30 publications

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“…Ionic liquids (ILs) are salts with comparably low melting points, often even below room temperature (RT). As ultrathin films, they are of utmost interest in current and potential future applications in catalysis, sensors, lubrication,, separation,, and electrochemistry, to name only a few. In these examples, the liquid/solid interface determines the function, performance and stability of the respective system.…”

Section: Figurementioning

confidence: 99%

Anion Exchange at the Liquid/Solid Interface of Ultrathin Ionic Liquid Films on Ag(111)

et al. 2018

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Thin ionic liquid (IL) films play an important role in many applications. To obtain a better understanding of the ion distribution within IL mixture films, we sequentially deposited ultrathin layers of two ILs with the same cation but different anions onto Ag(111), and monitored their dynamic behaviour by angle‐resolved X‐ray photoelectron spectroscopy. Upon depositing [C8C1Im][PF6] on top of a wetting layer of [C8C1Im][Tf2N] at room temperature (RT), we found a pronounced enrichment of the [Tf2N]− anions at the IL/vacuum interface, due to a rapid anion exchange at the IL/solid interface. In contrast, at 90 K, the [Tf2N]− anions remain at the IL/solid interface. Upon heating, we observe a rearrangement of the cations between 140 and 160 K, such that the octyl chains preferentially point towards the vacuum. Above 170 K, the ions start to become mobile, and at 220 K, the anion exchange is completed, with the [Tf2N]− anions enriched at the IL/vacuum interface in the same way as found for deposition at RT. The temperature range for the anion exchange corresponds well to glass transition temperatures reported in literature. We propose two driving forces to be cooperatively responsible for the replacement/exchange of [Tf2N]− at the IL/solid interface and its enrichment at the IL/vacuum interface. First, the adsorption energy of [C8C1Im][PF6] is significantly larger than that of [C8C1Im][Tf2N], and second, the surface tension of [C8C1Im][Tf2N] is lower than that of [C8C1Im][PF6].

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Section: Figurementioning

confidence: 99%

Anion Exchange at the Liquid/Solid Interface of Ultrathin Ionic Liquid Films on Ag(111)

et al. 2018

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“…Several ILs have been employed as electrolytes to deposit silver, such as tetrafluoroborate, 13,14 hexafluorophosphate, 15,16 bis(trifluoromethylsulfonyl)amide, 13,17 dicyanamide, 18 trifluoromethylsulfonate, 19,20 acetate, 21 and nitrate. 21 In most of these studies the focus was on the electrodeposition and the characterization of the deposited films.…”

Section: Introductionmentioning

confidence: 99%

Influence of a silver salt on the nanostructure of a Au(111)/ionic liquid interface: an atomic force microscopy study and theoretical concepts

Hoffmann

Pulletikurthi

Carstens

et al. 2018

Phys. Chem. Chem. Phys.

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Ionic liquids (ILs) form a multilayered structure at the solid/electrolyte interface, and the addition of solutes can alter it. For this purpose, we have investigated the influence of the silver bis(trifluoromethylsulfonyl)amide (AgTFSA) concentration in 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)amide ([Py]TFSA) on the layering using in situ atomic force microscopy. AFM investigations revealed that the Au(111)/electrolyte interface indeed depends on the concentration of the salt where a typical " IL" multilayered structure is retained only at quite low concentrations of the silver salt (e.g. ≤200 μM). However, at 200 μM AgTFSA/[Py]TFSA and above this "IL" multilayered structure is disturbed/varied. A simple double layer structure was observed at 500 μM AgTFSA in [Py]TFSA. Furthermore, the widths of the innermost layers have been found to be dependent on the concentration and on the applied electrode potentials. Our AFM results show that the concentration of solutes strongly influences the structure of the electrode/electrolyte interface and can provide new insights into the electrical double layer structure of the electrode/ionic liquid interface. We also introduce a semi-continuum theory to discuss the double layer structure.

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“…There are three oxidation peaks labelled as A1, A2 and A3 in the oxidation curve. A1 corresponds to the oxidation of Cu 0 /Cu + , A2 corresponds to the oxidation peak of the copper-silver alloy and A3 corresponds to the oxidation peak of Cu + /Cu 2+ [11,15]. Figure 2 shows the XRD test results of electrodeposition coating under different deposition conditions.…”

Section: Analysis Of Redox Behaviour Of Copper Ions and Silver Ionsmentioning

confidence: 99%

“…Rajagopal et al [10] conducted electrochemical behaviour studies of copper-silver alloy electrodeposition in a triethylammonium acetate ionic liquid. Reyna-González et al [11] studied the electrochemical behaviour and nucleation growth mechanism of copper-silver alloy electrodeposition in 3-butylpyridinium bis(trifluoromethanesulphonyl) imide. From the results of these studies, it can be seen that the morphology of the copper-silver alloy obtained in the fixed electrodeposition system is relatively simple, while the copper-silver alloy is often used as a catalyst, which may limit the application of the alloy plating.…”

Section: Introductionmentioning

confidence: 99%

Preparation of copper–silver alloy with different morphologies by a electrodeposition method in 1-butyl-3-methylimidazolium chloride ionic liquid

et al. 2019

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Electrodeposition of a copper-silver alloy based on a 1-butyl-3-methylimidazolium chloride (BMIC) ionic liquid was studied. The electrochemical behaviour of copper and silver ions was characterized by cyclic voltammogram. The morphologies and phase compositions of copper-silver alloy coating under different electrodeposition conditions were investigated by scanning electron microscopy and X-ray diffraction. The results show that copper-silver alloys with different micro-morphologies can be obtained under different potential conditions in BMIC. Co-deposition of the copper-silver alloy followed a two-step reduction process, the first step is the reduction of the cupric ion to the cuprous ion and the second step is the simultaneous reduction of the cuprous ion and the silver ion to form an alloy. A dendritic alloy can be obtained at − 0.60 V, a bract alloy can be obtained at − 0.80 V and a granular alloy can be obtained at − 1 V. The coating particle size at 60 • C was smaller than the particle size obtained at 40 • C. The Cu-Ag alloy prepared by electrodeposition in ionic liquids consists of single-phase copper and single-phase silver.

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Silver and silver–copper electrodeposition from a pyridinium-based ionic liquid

Cited by 36 publications

References 30 publications

Anion Exchange at the Liquid/Solid Interface of Ultrathin Ionic Liquid Films on Ag(111)

Anion Exchange at the Liquid/Solid Interface of Ultrathin Ionic Liquid Films on Ag(111)

Influence of a silver salt on the nanostructure of a Au(111)/ionic liquid interface: an atomic force microscopy study and theoretical concepts

Preparation of copper–silver alloy with different morphologies by a electrodeposition method in 1-butyl-3-methylimidazolium chloride ionic liquid

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