2007
DOI: 10.1002/ppap.200600163
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Similarities and Particularities of Low‐ and High‐Temperature Plasma Technologies

Abstract: Although plasmas cover an enormously wide range of parameters, and although the technologies and their applications differ strongly, several general mechanisms and technological processes, such as dimensionless parameters, generation and controlling of plasmas by particle wave interactions, plasma‐wall‐interactions, surface engineering and diagnostics are quite similar. Microwave technology offers both low temperature plasma applications and plasma heating for the fusion reactors. The interaction of plasmas wi… Show more

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Cited by 3 publications
(1 citation statement)
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“…Low temperature, weakly collisional plasmas are present in a wide variety of plasmas such as industrial plasmas used for plasma processing of semiconductors and thin film deposition [1][2][3][4], near the boundary of satellites in space [5], and scrapeoff layers of fusion study plasmas [6]. In most situations more than one ion species is present.…”
Section: Introductionmentioning
confidence: 99%
“…Low temperature, weakly collisional plasmas are present in a wide variety of plasmas such as industrial plasmas used for plasma processing of semiconductors and thin film deposition [1][2][3][4], near the boundary of satellites in space [5], and scrapeoff layers of fusion study plasmas [6]. In most situations more than one ion species is present.…”
Section: Introductionmentioning
confidence: 99%