1995
DOI: 10.1016/0168-583x(95)00043-7
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SIMOX: processing, layer parameters design, and defects control

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Cited by 6 publications
(5 citation statements)
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“…What is thus clear in this preliminary work is that the high dose, high temperature oxygen implantation, does not form continuous volumes of SiO 2 . In agreement with previous work [17], this should only be expected following postimplant annealing at around 1300…”
Section: Resultssupporting
confidence: 73%
See 1 more Smart Citation
“…What is thus clear in this preliminary work is that the high dose, high temperature oxygen implantation, does not form continuous volumes of SiO 2 . In agreement with previous work [17], this should only be expected following postimplant annealing at around 1300…”
Section: Resultssupporting
confidence: 73%
“…• C. The postimplant anneal is essential in order to finalize oxide formation, as it stimulates oxygen diffusion and SiO 2 formation via Ostwald Ripening [17], while repairing lattice damage. By this mechanism, small faulty zones and precipitates tend to coalesce into bigger aggregations in order to achieve a more favorable energy configuration.…”
Section: Ion Implanted Grating Design and Considerationsmentioning
confidence: 99%
“…Quantum dots were formed under various conditions [3,4]. Using very high ion fluences, buried layers were synthesized [5].…”
Section: Introductionmentioning
confidence: 99%
“…For example, high dose O ϩ implantation into Si wafers ͑500-700°C͒ followed by high-temperature annealing ͑1300-1405°C͒ has been used to produce Si film on buried SiO 2 substrates for advanced complementary metal-oxide semiconductor circuits. [1][2][3][4][5][6] Room-temperature implantation results in such a high level of irradiation damage in the top silicon layer that high quality silicon thin films cannot be made, even by high-temperature annealing. [1][2][3][4][5][6] This demonstrates the necessity for, and advantage of implantation at a high target temperature.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5][6] Room-temperature implantation results in such a high level of irradiation damage in the top silicon layer that high quality silicon thin films cannot be made, even by high-temperature annealing. [1][2][3][4][5][6] This demonstrates the necessity for, and advantage of implantation at a high target temperature. In a previous publication, 7 we reported some advantages and indirect evidence regarding dynamic annealing effects during high-temperature implantation of Ag ϩ into YBa 2 Cu 3 O 7Ϫ␦ ͑YBCO͒ oxide films.…”
Section: Introductionmentioning
confidence: 99%