A high-coupling-efficiency and convenient-integration transmitter optical subassembly for 25 Gbps small-form transceiver is developed in this paper. In the structure, the VCSEL is vertically mounted on the silicon substrate by the flip-chip method to enable direct and passive alignment with the fibers plugging in the fiber guide holes on the silicon substrate. By the optical simulation, the maximum coupling efficiency of VCSEL is 20.38 dB. The vertical electrical pads of the VCSEL are connected to the horizontal wire-bonding pads on silicon substrate by the 908-bend GS micro strip lines. Thus, the interconnection between the transmitter optical subassembly and the electrical PCB board is conveniently realized by the low-cost wire-bonding method. The electrical performance of the 908-bend GS micro strip lines on the optical subassembly is also evaluated by the 3D electromagnetic simulation. In order to verify the transmission performance of the transmitter optical subassembly, it is integrated with an electrical board using bonding wires, and then the optical performance of the transmitter is measured. By the measurement, the optical subassembly can operate up to 25 Gbps per channel.optical alignment, silicon optical bench, TOSA, 100 Gbps optical interconnect
| I NT RODU CTI ONWith rapid development of the high data transmission capacity, the appearance of the optical interconnection attracts great attention and becomes a potential alternative for the copper interconnection, since it has the ability of suppressing EMI and the features of low loss and high bandwidth. Currently, the optical interconnection has been applied in most places of the computing system, including long-reach and short-reach optical interconnection. Unlike the long reach systems, short-reach optical interconnection is applied in the data processing centers, consumer electronics and so on, and it mainly focuses on the reduction of the cost, power consumption and volume of the optoelectronic system. 1-3 Based on these reasons, low-cost vertical cavity surface emitting laser (VCSEL) produced at a large scale is widely applied in the short-reach optical intercommunication and the small-form transceiver is a promising optical module for the reduction of the size.The small-form optical module requires a transmitter optical subassembly focusing on the optical alignment and the integration difficulty with the electrical board. Previously, a number of optical subassemblies have been researched using several alignment techniques, including 458-titled mirror, 908-bend flexible film, 908-bend fiber connector and direct optical-coupling method. The 458-tilted mirrors 4,5 and 908-bend fiber connector 6,7 methods are able to provide 908-beam-deflection and avoid the 908-electricalinterconnection-deflection, which is convenient for the interconnection between the optical chips and electrical chips. But some disadvantages still exist in these two methods. For example, the optical coupling loss using the 458-titled mirror method is greater than 21.5 dB and hig...