2007
DOI: 10.1109/tcapt.2007.892097
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Simulation and Experimental Study of Laser Hammering for Laser Diode Packaging

Abstract: Laser hammering is a key and effective technique to correct the post-weld-shift in laser welding process. In order to obtain a detailed understanding of the shrinkage deformation principle and magnitude induced by laser Hammering, a finite-element-method (FEM) is employed to analyze the welding shift for the TO-CAN style laser diode package. Detailed relations between welding shift and the beam energy pulse width are obtained. A welding shift measurement system with two noncontact capacitive displacement senso… Show more

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Cited by 8 publications
(3 citation statements)
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“…This method is well established for telecommunication products [1], [2]. Even the welding-induced alignment distortion of the optics is well understood and can be corrected very precise and efficiently with the same equipment [3], [4].…”
Section: Solder Jet Ball Bumpingmentioning
confidence: 99%
“…This method is well established for telecommunication products [1], [2]. Even the welding-induced alignment distortion of the optics is well understood and can be corrected very precise and efficiently with the same equipment [3], [4].…”
Section: Solder Jet Ball Bumpingmentioning
confidence: 99%
“…Laser diode (LD), also known as a semiconductor laser, is widely used in the field of optical communication. As the most common means of the coaxial package in the LD industry, the TO-can package has been wildly used in the field of low-power laser packages [1][2][3]. As shown in Figure 1, the metal base is an important part of a TO-can, used to connect pins and luminous semiconductors.…”
Section: Introductionmentioning
confidence: 99%
“…An application of laser forming that received substantial attention in the recent years, is the high precision alignment and assembly of (small) components. This process is often referred to as 'laser adjusting' [10] or 'laser hammering' [26,27]. This process has been applied to several industrial applications where a sub-micron assembly accuracy was required [18,[27][28][29][30].…”
Section: High Precision Micro Assembly Using Laser Formingmentioning
confidence: 99%