Simulation and prediction in laser bending of silicon sheet

Wang, Xuyue; Xu, Wen Ji; Xu, Wenji; Hu, Yafeng; Liang, Yande; Wang, Lian-ji

doi:10.1016/s1003-6326(11)61086-8

Cited by 11 publications

(2 citation statements)

References 12 publications

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“…The result shows when temperature is 650 °C, the tin recovery is decreased to 95.69 % but when temperature increase to 850°C the recoveries of tin increase up to 98.71%. Recovery of tin shows no increment at 1050°C temperature [15]. It is because the reducing agent was weak and volatile when temperature increased at 850°C [6].…”

Section: Resultsmentioning

confidence: 99%

Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

Ismail

Jamil

Kamarudin

et al. 2016

MSF

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The pyrometallurgical method of tin extraction from lead free solder dross after leaching treatment is discussed. The solder dross is sieved into 75 μm was used for the experiment. The samples were leached using 0.3 M HCl, 12 hours stirring times and temperature of 60°C was used for the leaching before thermal treatment. The sample was thermally treated at temperature of 650,850 and 1050°C. The increase of heating temperature causes the lowering of the tin extraction. The optimum parameter for heating temperature is 850°C with 98.71% of tin recovery.

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Section: Resultsmentioning

confidence: 99%

Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

Ismail

Jamil

Kamarudin

et al. 2016

MSF

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“…Aluminium is also coupled with good conductivity, so it is a good idea that use copper/aluminium laminates instead of copper for preparing high-frequency cables and it illustrates a good prospect of application based on the idea of copper saving with aluminium [1]. In this paper, the interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied, based on the understanding of bonding mechanism and compound technology by rolling process [2][3][4][5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

Zhang

Qin

Zhao

et al. 2011

AMR

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The interfacial microstructure evolution of copper/aluminium laminates with different annealing processes was studied. It was found that the formation and growth of intermetallic compounds in the interface during metallurgical combination process have four stages: the incubation period, the formation of island-like new phases in local areas, the transverse-lengthwise-transverse growth of diffusion zone, the formation of new intermetallic compounds and thickening of diffusion zone.

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Finite Element Simulations of Laser Bending of Small Sized Sheets

Fetene

Dixit

2015

Lasers Based Manufacturing

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Simulation and prediction in laser bending of silicon sheet

Cited by 11 publications

References 12 publications

Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

Interfacial Microstructure Evolution of Copper/Aluminium Laminates with Different Annealing Processes

Finite Element Simulations of Laser Bending of Small Sized Sheets

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