Simulation of carbon nanotubes polymer based piezoresistive flexible pressure sensor for ultra sensitive electronic skin

Hegde, Roopa; Ramji, K.; Swapna, P.

doi:10.1109/iementech.2018.8465202

Cited by 6 publications

(5 citation statements)

References 15 publications

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“…Graphene is expected to be the main material used for fabricating flexible materials, as it is a zero band-gap semiconductor [58] with large mechanical stiffness of 1 TPa, making it unique even among two-dimensional materials [59]. A simulation on flexible electronics using carbon nanotubes has been performed under small-pressure conditions [60]. Considering that mechanical effects are dominant in flexible electronics, structural analysis software using finite element methods will be highly suitable for analysing them.…”

Section: B6 Flexible Materialsmentioning

confidence: 99%

Review: Numerical Simulations of Semiconductor Piezoresistance for Computer-Aided Designs

Sugiura

Matsuda

Nakano

2023

IEEE J. Electron Devices Soc.

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The field of piezoresistance has mainly advanced through experimental research; however, the improved accuracy of simulations and the emergence of new materials have increased the importance of simulations in this field. This review discusses the methods and current topics related to simulations of piezoresistive devices. Advancing simulation modeling will facilitate the computer-aided design of piezoresistive devices, and this review introduces the means of establishing these models by discussing the current studies on simulations and calculations in this field. Two simulation methods currently exist namely, device simulations and first-principles theoretical analysis. This review focuses on numerical simulation approaches for modeling of the piezoresistive effect using the multiphysics simulations of the mechanical and electrical behaviors of piezoresistive materials.

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Section: B6 Flexible Materialsmentioning

confidence: 99%

Review: Numerical Simulations of Semiconductor Piezoresistance for Computer-Aided Designs

Sugiura

Matsuda

Nakano

2023

IEEE J. Electron Devices Soc.

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“…By dispersing conductive fillers, such as electrically conductive particles, flakes, and/or wires, concentrated at their percolation threshold in the elastomeric matrixes, conductive pathsways are efficiently created [94]. Frequently used filler materials include carbon black (CB) particles [95], carbon nanotubes (CNTs) [96], silver nanoparticles (AgNPs) and nanowires (AgNWs) [97,98], and other metallic particles [99].…”

Section: Use Of Conductive Flexible Compositesmentioning

confidence: 99%

“…(a) The injection molding of a thermoplastic with the desired 3D shape; (b) The lasering step, which prepares the surface for metal deposition. This step creates crates on the surface of the structure, allowing the posterior adhesion of metal on the thermoplastic polymer during the final process; (c) The platting step that can be executed through electroless [71], or electrolytic plating [96].…”

Section: D-midmentioning

confidence: 99%

The role of printed electronics and related technologies in the development of smart connected products

Buga¹,

Viana²

2022

Flex. Print. Electron.

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The emergence of novel materials with flexible and stretchable characteristics, and the use of new processing technologies, have allowed for the development of new connected devices and applications. Using printed electronics, traditional electronic elements are being combined with flexible components and allowing for the development of new smart connected products. As a result, devices that are capable of sensing, actuating, and communicating remotely while being low-cost, lightweight, conformable, and easily customizable are already being developed. Combined with the expansion of the Internet of Things, artificial intelligence, and encryption algorithms, the overall attractiveness of these technologies has prompted new applications to appear in almost every sector. The exponential technological development is currently allowing for the “smartification” of cities, manufacturing, healthcare, agriculture, logistics, among others. In this review article, the steps towards this transition are approached, starting from the conceptualization of smart connected products and their main markets. The manufacturing technologies are then presented, with focus on printing-based ones, compatible with organic materials. Finally, each one of the printable components is presented and some applications are discussed.

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“…The development of micro metal coils also benefits from the significant progress of advanced microfabrication technologies, such as microelectronic technology, integrated circuit technology, and its processing technology, MEMS preparation technology, and film and flexible electronic processing technology [34][35][36]. The substrate materials mainly include silicon, glass, ceramic materials and flexible materials [37][38][39][40][41][42]. The hard substrate has a high degree of hardness and good dielectric properties, but for some non-planar surfaces and curved surfaces, it is necessary to use a flexible substrate to prepare sensors.…”

Section: Introductionmentioning

confidence: 99%

“…Micro metal coils are mainly divided into two structural types: three-dimensional coils and planar coils. Three-dimensional coils are mainly solenoid-type micro coils, and planar coils can be subdivided into single-layer coils and multi-layer coils [40][41][42]. The single-layer planar coil has no magnetic core-binding circuit, and the magnetic leakage is significant.…”

Section: Introductionmentioning

confidence: 99%

Recent Progress in the Preparation Technologies for Micro Metal Coils

et al. 2022

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The recent development of micro-fabrication technologies has provided new methods for researchers to design and fabricate micro metal coils, which will allow the coils to be smaller, lighter, and have higher performance than traditional coils. As functional components of electromagnetic equipment, micro metal coils are widely used in micro-transformers, solenoid valves, relays, electromagnetic energy collection systems, and flexible wearable devices. Due to the high integration of components and the requirements of miniaturization, the preparation of micro metal coils has received increasing levels of attention. This paper discusses the typical structural types of micro metal coils, which are mainly divided into planar coils and three-dimensional coils, and the characteristics of the different structures of coils. The specific preparation materials are also summarized, which provides a reference for the preparation process of micro metal coils, including the macro-fabrication method, MEMS (Micro-Electro-Mechanical System) processing technology, the printing process, and other manufacturing technologies. Finally, perspectives on the remaining challenges and open opportunities are provided to help with future research, the development of the Internet of Things (IoTs), and engineering applications.

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Simulation of carbon nanotubes polymer based piezoresistive flexible pressure sensor for ultra sensitive electronic skin

Cited by 6 publications

References 15 publications

Review: Numerical Simulations of Semiconductor Piezoresistance for Computer-Aided Designs

Review: Numerical Simulations of Semiconductor Piezoresistance for Computer-Aided Designs

The role of printed electronics and related technologies in the development of smart connected products

Recent Progress in the Preparation Technologies for Micro Metal Coils

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