2006
DOI: 10.1016/j.mee.2006.01.140
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Simulation of ion beam direct structuring for 3D nanoimprint template fabrication

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Cited by 44 publications
(37 citation statements)
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“…The TRIDYN code was used to obtain angle-dependent sputter yields, but the redeposition effect is not considered in DINESE code which means that it is only applicable to simulate the machining of low-aspect-ratio structures. Biedermann and Platzgummer developed a software package called Ionshaper [33] which included first-and second-order sputtering as well as the first-and second-order redeposition of sputtered atoms. The natural erosion process was characterised by a surface velocity vector normal to the surface and a surface shape with a fully continuous derivative.…”
Section: Surface Topography Simulation In Fib Machiningmentioning
confidence: 99%
“…The TRIDYN code was used to obtain angle-dependent sputter yields, but the redeposition effect is not considered in DINESE code which means that it is only applicable to simulate the machining of low-aspect-ratio structures. Biedermann and Platzgummer developed a software package called Ionshaper [33] which included first-and second-order sputtering as well as the first-and second-order redeposition of sputtered atoms. The natural erosion process was characterised by a surface velocity vector normal to the surface and a surface shape with a fully continuous derivative.…”
Section: Surface Topography Simulation In Fib Machiningmentioning
confidence: 99%
“…This is because at a fixed ion beam current and number of scan loops, an increase of the exposure time leading to the reduction of the scan speed, which results in an increase of the local beam incident angle [22], and thus a higher redeposition rate. The redeposition effect on features' cross-sections when milling fused silica coated with a thin Cr layer [23] and Si [24][25][26] was studied in details. Other factors, e.g., surface diffusion could also affect the surface morphology and profile evolution of the trenches.…”
Section: Profile Evolution (Amorphous Ni 78 B 14 Si 8 )mentioning
confidence: 99%
“…Other factors, e.g., surface diffusion could also affect the surface morphology and profile evolution of the trenches. By comparing the results, a conclusion can be made that the evolution of trench profiles is closely dependent on the feature size and geometry, substrate materials, scan speed, scan strategy and f i [21][22][23][24][25][26][27][28][29][30]. Fig.…”
Section: Profile Evolution (Amorphous Ni 78 B 14 Si 8 )mentioning
confidence: 99%
“…The variation of the sputtering rate and the re-depositing effect on features' cross sections when milling Si was studied in details both experimentally and theoretically [19]. In particular, with the increase of aspect ratios the trenches in Si become narrower and their shape changes due to the re-depositing effect.…”
Section: Characterisation Of Trenches In Fused Silica Produced With Vmentioning
confidence: 99%