2019
DOI: 10.1038/s41928-019-0233-2
|View full text |Cite
|
Sign up to set email alerts
|

Simultaneous synthesis and integration of two-dimensional electronic components

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

2
103
1

Year Published

2019
2019
2023
2023

Publication Types

Select...
4
4

Relationship

0
8

Authors

Journals

citations
Cited by 123 publications
(106 citation statements)
references
References 31 publications
2
103
1
Order By: Relevance
“…As a member of 2D transition metal dichalcogenides (TMDs), MoTe 2 has attracted prominent interests due to its moderate bandgap of ≈0.8–1.1 eV, ambipolar transport characteristics, and rich phases (1T, metallic, 1T′, semimetallic, and 2H, semiconductor) . Many efforts have focused on the engineering of phase transition between 1T or 1T′ and 2H‐MoTe 2 , i.e., by IL gate‐induced charge injection, growth temperature or seed layer for chemical vapor deposition (CVD), or laser‐generated hot spot . Meanwhile, the ambipolar behavior of 2H‐MoTe 2 makes it of particular interest for functional devices.…”
Section: Introductionmentioning
confidence: 99%
“…As a member of 2D transition metal dichalcogenides (TMDs), MoTe 2 has attracted prominent interests due to its moderate bandgap of ≈0.8–1.1 eV, ambipolar transport characteristics, and rich phases (1T, metallic, 1T′, semimetallic, and 2H, semiconductor) . Many efforts have focused on the engineering of phase transition between 1T or 1T′ and 2H‐MoTe 2 , i.e., by IL gate‐induced charge injection, growth temperature or seed layer for chemical vapor deposition (CVD), or laser‐generated hot spot . Meanwhile, the ambipolar behavior of 2H‐MoTe 2 makes it of particular interest for functional devices.…”
Section: Introductionmentioning
confidence: 99%
“…The traditional method to reduce the contact resistance for silicon is to decrease the depletion region width by locally doping near the metal-silicon junction, which is invalid in 2D devices. The devices based on 2D materials were usually fabricated using direct metal electrode deposition that can introduce defects and impurities, which leads to a reduction in device performance 1 . Recently, contacting 2D semiconductors through seamless coplanar 2D metal, such as metallic 1 T-MoS 2 / semiconducting 2H-MoS 2 (ref.…”
mentioning
confidence: 99%
“…Scalable monolayer MoTe 2 with 100% coverage has been grown on inert SiO 2 substrate. The dynamic-controlled growth can also be extended to synthesizing film on sapphire substrate [61]. Layer-bylayer epitaxial growth of WSe 2 thin film on Al 2 O 3 substrates and its ambipolar electronic characteristic has been reported by Nakano et al [31] Similar epitaxial growth recipe is also applicable for other TMD films as well.…”
Section: Wafer-scale Growth Of Tmdsmentioning
confidence: 86%
“…For the two-step vapor chalcogenization method, precursors containing transition metal like Mo [59], MoO 3 [60,61], or (NH 4 ) 2 MoS 4 [55] are initially deposited as thin films on the substrate, followed by a chemical reaction in chalcogenide (S, Se or Te) enriched environment at high temperature. This method can produce large-area film with excellent uniformity, mainly because the thin film deposition can be carried out in a controllable manner, by various deposition techniques, including thermal evaporation, Ebeam evaporation, ALD, magnetron sputtering, as well as the convenient spin-coating method.…”
Section: Wafer-scale Growth Of Tmdsmentioning
confidence: 99%
See 1 more Smart Citation