Single- and two-phase heat exchangers for power electronic components

Gillot, C.; Bricard, A.; Schaeffer, Christian

doi:10.1016/s1290-0729(00)00278-7

Cited by 18 publications

(13 citation statements)

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“…The progressive size reduction of electronic devices is inevitably leading to a crucial heat dissipation issue in designing novel components [1]. In fact, overheating conditions could significantly affect the performances and durability of electronic devices, eventually reducing their expected life [2].…”

Section: Introductionmentioning

confidence: 99%

Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration

et al. 2016

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Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooling. Because of the many design parameters to be considered, developing both cost and thermal effective PFHS is a critical issue. Here, a novel thermal model of PFHS is presented. The model has a broad field of applicability, being comprehensive of the effects of flow bypass, developing boundary layers, fin efficiency and spreading resistance. Experiments are then carried out to validate the proposed thermal model, and its good accuracy is demonstrated. Finally, an optimization methodology based on genetic algorithms is proposed for a cost-effective selection of the design parameters of PFHS, which is particularly effective with semi-active configurations. Such an optimization methodology is then tested on a commercial heat sink, resulting in a possible 53% volume reduction at fixed thermal performances.

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Section: Introductionmentioning

confidence: 99%

Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration

et al. 2016

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“…Their effectiveness can be improved when one introduces the coolant stream as close to the heat source as possible. This idea has been employed in a new solution of a liquid cooling system that is based on microchannels formed in the substrate of semiconductor device [3][4][5], or in cooling microstructure placed at the chip directly [6,7]. Unfortunately, such a huge heat transfer capacity has been observed at very large inlet pressure, e.g.…”

Section: Introductionmentioning

confidence: 99%

“…Although the differences in the behaviour of liquid flow in the micro-and macrostructures have been already reported [3][4][5][6][7][8][9][10][11][12], no coherent explanation of their origin exists. In [11], they have noticed that the flow character in microchannels changes for much smaller values of Reynolds numbers.…”

Section: Introductionmentioning

confidence: 99%

The Numerical Approach to Analysis of Microchannel Cooling Systems

Raj

Lisik

Langer

et al. 2005

Lecture Notes in Computer Science

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Abstract. The paper deals with microchannel cooling where water is the cooling liquid. ANSYS software and CFDRC-ACE one were used to analyse the flows and the origin of large amount of heat that can be overtaken from the chip when microchannels are applied. The concept of microscale heat transfer coefficient is discussed. The phenomena taking place in microchannel flows are simulated and some conclusions are introduced to explain the results met in many references but still unexplained. In contrast to existing, standard methods, the new approach describes the local phenomena and is used in the further investigation of the cooling microstructure. An effect of its geometry on the total overtaken heat flux is analysed with respect to optimal conditions as well as to technological restrictions.

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“…The local Nusselt number distribution along the wall, Nu x , was found to be a function of Z/B ratio, where Z is nozzleto-wall distance and B is the slot width. A heat exchanger for power electronic components was studied by Gillot et al [12]. The prototype was composed of four elementary modules.…”

mentioning

confidence: 99%

“…The heat spread effect was observed to be a function of the heat transfer coefficient. For the case before jet breakdown For the case after jet break down Gillot [12] minute, m-mass flow rate, V-volume flow rate, PDMS-polydimethylsiloxane, Z-nozzle-to-wall distance, L-distance from nozzle to the breakdown point of the jet, HE-heat exchanger), Kr-thermal conductivity ratio, and -performance index) Table 1. Summary of the microchannel heat exchangers with single phase flow [3,4].…”

mentioning

confidence: 99%