Site-Selective Electroless Nickel Plating on Patterned Thin Films of Macromolecular Metal Complexes

Abstract

We demonstrate a simple route to depositing nickel layer patterns using photocross-linked polymer thin films containing palladium catalysts, which can be used as adhesive interlayers for fabrication of nickel patterns on glass and plastic substrates. Electroless nickel patterns can be obtained in three steps: (i) the pattern formation of partially quaterized poly(vinyl pyridine) by UV irradiation, (ii) the formation of macromolecular metal complex with palladium, and (iii) the nickel metallization using electroless plating bath. Metallization is site-selective and allows for a high resolution. And the resulting nickel layered structure shows good adhesion with glass and plastic substrates. The direct patterning of metallic layers onto insulating substrates indicates a great potential for fabricating micro/nano devices.

Selective Cu Patterning on Polyimide Using UV Surface Treatment and Electroless Plating

“…However, these conventional Cu/PI pattering techniques have some drawbacks (e.g., low cost-efficiency and the numerous lithography steps) [8,9]. Recently, selective Cu metallization processes without going through photoresist patterning process have been considered as an alternative to conventional metallization technologies owing to its high cost-efficiency and process improvement [10][11][12][13]. Those approaches using electroless plating technology have been attempted to be utilized in various selective metallization processes such as ink jet printing, laser patterning techniques and micro-contact printing [14,15].…”

A Photocurable Pd Nanoparticle/Silica Nanoparticle/Acrylic Polymer Hybrid Layer for Direct Electroless Copper Deposition on a Polymer Substrate

“…Hybrid materials composed of polymers and nanoparticles are of great scientific and industrial interest because of their unique properties such as conductivity, sustainability, and permeability [1][2][3][4][5][6]. Efforts have been made to incorporate nanoparticles, such as metal nanoparticles and metal oxide nanoparticles, into polymer matrices, given the fact that a nanoparticle-dispersed polymer material (nanoparticle/polymer hybrid) derives its properties from the nanoparticles, such as catalytic activity [1,2] and optical properties [3,4].…”

“…Efforts have been made to incorporate nanoparticles, such as metal nanoparticles and metal oxide nanoparticles, into polymer matrices, given the fact that a nanoparticle-dispersed polymer material (nanoparticle/polymer hybrid) derives its properties from the nanoparticles, such as catalytic activity [1,2] and optical properties [3,4]. Metal nanoparticle/polymer hybrid films can be prepared by the deposition of metal nanoparticles on the surface of a polymer film and by in situ formation of metal nanoparticles via the reduction of the metal ions by reducing agents [1][2] and photochemically generated radicals [5][6][7][8][9]. Benzoin [6][7][8] and polysilane [9] function as a photo radical initiator to produce metal nanoparticles in solvents and polymer matrices.…”

“…While surface preparation, such as etching to increase the surface roughness, is necessary to provide good adhesion, it can affect the physical properties of the deposited metal film and damage the polymer substrate. Recently, to fabricate a micro pattern such as electric circuits, a simple and cost-effective approach containing direct metallization of photolithographic and printed patterns has attracted much attention [1,2,[12][13][14][15]. Copper is the most important metal in this process, because of its high conductivity and low electromigratory property.…”

Direct Electroless Copper Deposition on A Photolithographic Pattern of Palladium-Nanoparticle/Acrylic-Polymer Hybrid

“…Recently, an alternative approach to the fabrication of the metallic pattern using a combination of photolithography and electroless plating has been reported. [1][2][3][4] Copper is the most important metal for this because of its high conductivity and low electromigratory property. Therefore, we have proposed fabricating the copper micropattern by electroless plating on the pattern formed by photolithography as shown in Fig.…”