SIW Q-band filters using advanced multilayer PCB technology

Cadiou, Stéphane; Quendo, Cédric; Schlaffer, Erich; Pessl, Walter; Fevre, Alain Le; Brizoux, M.; Baudet, D

doi:10.1109/eumc.2014.6986619

Cited by 9 publications

(6 citation statements)

References 9 publications

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“…Table 1 compares the performance of the proposed multilayer AFSIW filter with respect to multilayer filtering structures reported in [8, 9] and [7]. It can clearly be seen that the AFSIW topology improves the performance as compared with the other structures.…”

Section: Resultsmentioning

confidence: 99%

“…It has been evaluated that an overcut of about 25 µm must be taken into account for the laser machining process used for the fabrication of this prototype. Table 1 compares the performance of the proposed multilayer AFSIW filter with respect to multilayer filtering structures reported in [8,9] and [7]. It can clearly be seen that the AFSIW topology improves the performance as compared with the other structures.…”

Section: Fig 3 Measured and Simulated Resultsmentioning

confidence: 99%

“…In [8], a substrate mounted waveguide (SMW) filter, a structure mixing SIW and pure metallic waveguide, has been presented. In [9], using a multilayer PCB process, the authors have reported fourth‐ and sixth‐order filters.…”

Section: Introductionmentioning

confidence: 99%

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Ka‐band compact and high‐performance bandpass filter based on multilayer air‐filled SIW

et al. 2017

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A substantial reduction of substrate integrated waveguide (SIW) insertion loss can be achieved through the use of air as dielectric instead of usual dielectric material. However, air-filled SIW (AFSIW) circuits exhibit larger footprint compared with their dielectric-filled counterparts. A compact multilayer AFSIW bandpass filter is proposed to realise both high-performance and small footprint. For demonstration purpose, a Ka-band multilayer fourth-order AFSIW bandpass filter has been designed and fabricated. Measured and simulated results are in good agreement. Retro-simulations, taking into account fabrication tolerances, are also presented. Finally, a performance comparison with other multilayer technologies is presented.

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Section: Resultsmentioning

confidence: 99%

Section: Fig 3 Measured and Simulated Resultsmentioning

confidence: 99%

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Ka‐band compact and high‐performance bandpass filter based on multilayer air‐filled SIW

et al. 2017

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“…3D multi-layers technologies such as LTCC [1] or high density multilayers PCB (HD-PCB) [2] are currently being strongly developed because they offer considerable size reduction as well as the embedded function possibilities. For microwave applications such as filters, couplers, diplexers… [3,4], these 3D structures offer new design possibilities for frequencies up to 100 GHz. HD-PCB structures consist of several metal layers separated by dielectric substrates.…”

Section: Introductionmentioning

confidence: 99%

“…For microwave applications such as filters, couplers, diplexers, etc. [3, 4], these 3D structures offer new design possibilities for frequencies up to 100 GHz.…”

Section: Introductionmentioning

confidence: 99%

Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions

Gouguec

Mahdi

Cadiou

et al. 2016

Int. J. Microw. Wireless Technol.

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The recent developments in electronic cards such as the network equipment are characterized by the miniaturization of the board size and the increasing complexity of the layout. Because of these requirements, multi-layered printed circuit boards are commonly used and vias connecting signal lines on different layers, or integrated circuit devices to power and ground planes, are frequently used and often essential. However, a via is not an ideal transmission line. Besides, it creates discontinuities at high frequencies leading to high insertion loss degradation of signal which limits the performances of integrated circuit and systems. In this paper, the impacts of coupling between via and parallel-plates cavity on the response of microwave integrated devices are highlighted in the first part. Then, to describe the intrinsic interaction between the via transition and parallel-plate modes, the notion of parallel-plates matrix impedances is presented and new boundary conditions like open or plated through holes shielded boundaries of the cavities are introduced. Then, using this physics-based model, an intuitive equivalent circuit has been developed. Finally, the proposed approach and the equivalent circuits were validated by using comparisons with electromagnetic simulations and measurements in different scenarios.

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A novel Ka-band MMIC coupled filter with harmonic suppression

Guan

Gong

Gao

2020

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Purpose A novel Ka-band compact parallel-coupled microstrip bandpass filter with harmonic suppression performance has been designed, implemented and tested on GaAs MMIC. Design/methodology/approach This proposed filter consists of modified coupled-line units with T-shaped open-stubs. Findings The proposed filter with T-shaped open-stubs is valuable in performance with low loss at fundamental frequency, suppression at harmonic frequencies and small size. The simulation is based on full-wave electromagnetic analysis and the measurement is based on chip test. It shows an insertion loss below 1.2 dB, return loss better than 20 dB in the pass band and high than 28 dB suppression at harmonic frequencies. Originality/value This Ka-band MMIC filter with harmonic suppression is attractive for the millimeter-wave system.

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SIW Q-band filters using advanced multilayer PCB technology

Cited by 9 publications

References 9 publications

Ka‐band compact and high‐performance bandpass filter based on multilayer air‐filled SIW

Ka‐band compact and high‐performance bandpass filter based on multilayer air‐filled SIW

Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions

A novel Ka-band MMIC coupled filter with harmonic suppression

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