Size-controlled synthesis of highly dispersed silver particles

Chen, Liang; Li, Zhen; Xiao, Chengjing; Wang, Zaiqin; Han, Wei

doi:10.1007/s10854-012-0954-8

Cited by 9 publications

(9 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Regarding the grain orientation evolution, the pre-existing boundaries may act as favorable nucleation sites for recrystallization, especially when they are inclined at 45 degrees to the interface [7]. The crack path diverts from the stress concentration area (neck region of solder interconnect) into the less stressed area (with an X-shaped zone) in the solder bulk along the pre-existing or newly recrystallized grain boundaries (see Fig.…”

Section: Resultsmentioning

confidence: 99%

“…Depending on as-solidified grain structure, the orientations of grains and subgrains evolved during thermal cycling, which can be induced by the rotation of grains or subgrains from the orientations of the parent grains (see superimposed crystal lattice on EBSD orientation map in Fig. 4) [7]. The rotation axis appears to be [1 1 0] as shown in 1 1 0 pole figures.…”

Section: Resultsmentioning

confidence: 99%

“…Recrystallization was frequently observed in Sn-based solder interconnects during thermal cycling and power cycling [4][5][6][7]. It has been identified that recrystallization significantly changes the grain size and orientation of Sn-based solder interconnects under the combined effect of temperature and thermomechanical stress during thermal cycling.…”

Section: Introductionmentioning

confidence: 99%

“…It has been identified that recrystallization significantly changes the grain size and orientation of Sn-based solder interconnects under the combined effect of temperature and thermomechanical stress during thermal cycling. Since the recrystallized region contains a network of grain boundaries, cracks tend to propagate through the degraded recrystallized microstructure via intergranular cracking [5][6][7][8][9]. Therefore, the initiation and propagation of the recrystallized microstructure become one of the critical concerns of solder interconnect reliability.…”

Section: Introductionmentioning

confidence: 99%

“…Recently, continuous recrystallization is assumed to occur in real solder interconnects with gradual increase in misorientation of low-angle grain boundaries by subgrain rotation and coalescence [3,7]. The details of underlying mechanisms of recrystallization remain elusive and require further study.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress

Chen

2012

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress

Chen

2012

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Preparation of micro-sized and monodisperse crystalline silver particles used for silicon solar cell electronic paste

Wang

Cui

et al. 2013

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Effect of Various Parameters on the Shear Strength of Solid-State Nanoporous Cu Bonding in Cu–Cu Disks for Power Device Packaging

Park

Han

Saito

et al. 2022

J. Electron. Mater.

View full text Add to dashboard Cite

Nanoparticle sintering is considered a promising alternative bonding method to Pb-based soldering for the attachment of components in high-temperature electronic devices. However, the technology still poses certain challenges, such as di culty controlling joint thickness and the generation of voids owing to solvent evaporation. In this study, a solid-state (solvent-free), nanoporous-Cu (NPC) bonding method was examined. The effect of bonding temperatures (200-400°C) and atmospheres (N 2 or formic acid) on the shear strength of joints formed between NPC sheets and bare Cu disks were investigated by scanning electron microscopy, X-ray diffraction, and transmission electron microscopy. It was shown that the bondability of NPC under an N 2 atmosphere is closely related to the oxide layer formed on its surface that impairs the diffusion of Cu atoms between the NPC and Cu substrate. Furthermore, the coarsening of the NPC microstructure under a formic acid atmosphere at ≥ 350°C owing to the rapid diffusion of Cu atoms and accompanying plastic deformation induced by surface stress enhances the shear strength of the resulting NPC/Cu joint. The shear strength of NPC/Cu joints formed under a formic acid atmosphere increased from 14.1 to 35.9 MPa with increasing bonding temperature. Based on the results of the investigation, a mechanism was proposed to explain the superiority of the Cu-Cu joints achieved using this method.

show abstract

Size-controlled synthesis of highly dispersed silver particles

Cited by 9 publications

References 29 publications

Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress

Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress

Preparation of micro-sized and monodisperse crystalline silver particles used for silicon solar cell electronic paste

Effect of Various Parameters on the Shear Strength of Solid-State Nanoporous Cu Bonding in Cu–Cu Disks for Power Device Packaging

Contact Info

Product

Resources

About