Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures

The shear performance and fracture behavior of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing electric current density (from 1.0 × 103 to 6.0 × 103 A/cm2) at various test temperatures (25 °C, 55 °C, 85 °C, 115 °C, 145 °C, and 175 °C) were investigated systematically. Shear strength increases initially, then decreases with increasing current density at a test temperature of no more than 85 °C; the enhancement effect of current stressing on shear strength decreases and finally diminishes with increasing test temperatures. These changes are mainly due to the counteraction of the athermal effect of current stressing and Joule heating. After decoupling and quantifying the contribution of the athermal effect to the shear strength of solder joints, the results show that the influence of the athermal effect presents a transition from an enhancement state to a deterioration state with increasing current density, and the critical current density for the transition decreases with increasing test temperatures. Joule heating is always in a deterioration state on the shear strength of solder joints, which gradually becomes the dominant factor with increasing test temperatures and current density. In addition, the fracture location changes from the solder matrix to the interface between the solder matrix and the intermetallic compound (IMC) layer (the solder/IMC layer interface) with increasing current density, showing a ductile-to-brittle transition. The interfacial fracture is triggered by current crowding at the groove of the IMC layer and driven by mismatch strain at the solder/IMC layer interface, and the critical current density for the occurrence of interfacial fracture decreases with increasing test temperatures.

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“…The opening diameter of the pad was 480 μm. The fabrication procedure of the joint was the same as it was in our previous study [29].…”

Section: Experimental Procedures and Simulation Modelmentioning

confidence: 99%

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

Wang

Pan

2022

Crystals

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“…Similar with many other materials, the Sn3.0Ag0.5Cu solder shows a prominent DBT as the temperature declines. Besides the influence of temperature, for the line-type Cu/Sn3.0Ag0.5Cu/Cu solder joints under tensile stress, the DBT can also happen when the joint thickness decreases, and the DBTT increases with decreasing joint thickness [3]. While, for the ball grid array structure Cu/Sn3.0Ag0.5Cu/Cu solder joints under shear stress, the DBTT decreases with decreasing joint thickness, which is contrary to that in the former case [4].…”

Section: The Application Of Holism In Understanding the Ductile-to-br...mentioning

confidence: 99%

Preliminary Application of Reductionism and Holism in Teaching Mechanical Engineering Materials

Li¹

2022

Proceedings of the 2022 2nd International Conference on Education, Information Management and Service Science (EIMSS 2022)

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In teaching a key curriculum, Mechanical Engineering Materials, in the discipline of mechanical engineering, reductionism and holism were applied. Besides the calculation of atomic packing factor, three key knowledge points were abstracted by applying reductionism, which were the model on bonding forces and energies of two isolated atoms, diffusion theory, and minimum-energy principle. Basing on these three key knowledge points, plenty of the contents in this curriculum can be understood easily and the learning efficiency can be elevated. Moreover, due to the deficiency of reductionism in analyzing complex issues, such as the influence of electric current stressing on the strength of materials and the ductile-to-brittle transition of a structure at low temperature, holism was applied concurrently. These applications can not only improve the teaching efficiency under a curriculum time shrinking condition, but also show students how to analyze complex issues.

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Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures

Li,

Chen,

Gui

et al. 2023

Microelectronics Reliability

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Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures

Cited by 3 publications

References 25 publications

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

Preliminary Application of Reductionism and Holism in Teaching Mechanical Engineering Materials

Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures

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