Skin Effect Suppressed Ni–Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Yamaguchi, Masahiro; Yanai, Takeshi; Nakayama, Hidetoshi; Sai, Ranajit; Fujiwara, Hiroaki; Yuki, Kitai; Sato, Mikio; Sangawa, Ushio

doi:10.1109/tmag.2018.2866126

Cited by 2 publications

(1 citation statement)

References 11 publications

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“…In general, the diameter of the wire can be selected for smaller than two times for the thickness of the skin depth, δ [31][32]. This design guideline can improve the skin effect efficiently.…”

Section: D1 Determine the Diameter Of Wirementioning

confidence: 99%

Design and Implementation of a Full-Bridge LLC Converter With Wireless Power Transfer for Dual Mode Output Load

Wu¹,

Han

2021

IEEE Access

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The proposed research is to accomplish a converter for driving DC load or AC load with wireless power transfer (WPT) technique. In this novel scheme, a full-bridge LLC resonant converter is adopted to deliver the energy from the primary to the secondary side. Besides, the LLC converter has softswitching characteristic of the switches at the primary to improve the efficiency of the converter if the switching frequency is selected appropriately. In order to achieve the feature of wireless power transfer, the WPT (transmitting/receiving) coils are utilized to replace the transformer. The leakage inductor can be treated as a resonant inductor integrated in the transmitting coil. In the output side, a sinusoidal pulse width modulation (SPWM) technique is added to generate AC voltage for specific load. In other words, the proposed converter can output DC or AC voltage by user's demand. In the end of this research, a LLC converter with WPT technique for 1kW is implemented. The experimental results and the related waveforms are also shown in the content. In this topology, the highest efficiency of DC output is 89.2%, and the highest efficiency of AC output is 82.6% respectively.

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Section: D1 Determine the Diameter Of Wirementioning

confidence: 99%

Design and Implementation of a Full-Bridge LLC Converter With Wireless Power Transfer for Dual Mode Output Load

Wu¹,

Han

2021

IEEE Access

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Theoretical study on lowering loss of skin effect suppressed multi-layer transmission line with positive/negative (Cu/NiFe) permeability materials for high data-rate and low delay-time I/O interface board

et al. 2020

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This paper proposes a new application of skin effect suppression technology for long wiring on high-speed & low-delay I/O board. This proposal will overcome the difficulty of further reducing the transmission losses on the I/O board with vert >vert 50 Gb/s data rate. In previous research, it was demonstrated that suppression of the skin effect by electroplated conductor/magnetic multi-layer, and estimated that the degree of transmission loss decrease at 16 GHz would be 5 %. A major challenge in this paper is to propose an electromagnetic field calculation theory for rectangular multi-layer transmission line, verify it under the same conditions, clarify a lower loss structure by changing thickness of each layer. Also it is expanded to low loss design technology. Cu and NiFe were selected as metal conductor material and negative permeability magnetic material, respectively. The Cu and NiFe films are alternately stacked to form the multi-layer. The top and bottom surface layers are Cu layers. The loss suppression was compared under the following conditions. 1) Total number of layers was 33 and total thickness was 12.67 μm by a constant ratio, Cu: tN = 0.51μm and NiFe: tF = 0.25μm. 2) Optimal stacking determined by changing the thickness of each layer. Compared to conventional thickness by a constant ratio 1), in our proposal 2), we estimated that the loss would dropped to 92% in optimal thickness. By offsetting the phase change of current density, a lower loss structure could be determined. Compared with Cu conductor, the top and bottom surface current densities become low, and depth center current density becomes slightly high for the multi-layer, showing the skin effect is suppressed.

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Skin Effect Suppressed Ni–Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Cited by 2 publications

References 11 publications

Design and Implementation of a Full-Bridge LLC Converter With Wireless Power Transfer for Dual Mode Output Load

Design and Implementation of a Full-Bridge LLC Converter With Wireless Power Transfer for Dual Mode Output Load

Theoretical study on lowering loss of skin effect suppressed multi-layer transmission line with positive/negative (Cu/NiFe) permeability materials for high data-rate and low delay-time I/O interface board

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