Small particle melting of pure metals

Allen, G.L.; Bayles, Robert; Gile, W.W.; Jesser, W. A.

doi:10.1016/0040-6090(86)90422-0

Cited by 434 publications

(275 citation statements)

References 20 publications

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“…11,[18][19][20][21][22][23][24][25] In addition, a correlation between T m and the NP diameter has been commonly observed, with decreasing T m with decreasing NP size. 3 Since for bulk systems T m is proportional to Θ D 2 (Lindemann's criterion 26 ), the Debye temperature is also expected to decrease in clusters relative to the bulk 27 .…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic properties of Pt nanoparticles: Size, shape, support, and adsorbate effects

et al. 2011

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Section: Introductionmentioning

confidence: 99%

Thermodynamic properties of Pt nanoparticles: Size, shape, support, and adsorbate effects

et al. 2011

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“…It is common knowledge that melting temperature of small particles, thin metal, and alloy films is a function of size [6,7,22,[27][28][29][30][31][32][33][34][35][36]. When considered in terms of thermodynamics, there exist several models to describe the size dependence of melting temperature of small particles [27]; however, as the quantitative analysis of experimental data shows, the triple point model proves to be the most feasible.…”

Section: Decrease In Small Particles Melting Temperature and Surface mentioning

confidence: 99%

Surface Energy and Wetting in Island Films

Дукаров¹,

Kryshal²,

Sukhov³

2015

Wetting and Wettability

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The chapter describes the fundamental aspects of the effects of scale on surface phenomena in condensed films. Experimental and theoretical data for the size and temperature dependencies of the surface energy (including the solid phase); wetting of solid surfaces and free thin films by small metal particles are discussed. Several modern methods of contact angle measurement in small-sized systems based on the optical and electron microscopy methods are described.

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“…This phenomenon, called the Gibbs-Thomson effect, results from significant contributions of the surface energy to the free energy of the system. Due to their high value of surface area to volume ratio, diffusion regimes in silver nanoparticles are activated at lower temperature than the bulk melting point (961°C) [12,13]. Nonetheless, densifying and non-densifying sintering regimes have been previously identified as consuming the given thermal energy.…”

Section: Microstructural Evolution With Sinteringmentioning

confidence: 99%

Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

Cauchois

Saadaoui

Legeleux

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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The nanoporous nature of the inkjet printed silver nanoparticles entail low hardness and surface effective contact area for being compatible with pads that are suitable for wire-bonding in electronic packaging. Electroless nickel plating is a selective metal deposition technique which can brings the required thickness and hardness for further pads processing. Here, a 1.7 µm thick nickel layer is deposited on top of 600 nm thick printed and sintered silver nanoparticles using Kapton polyimide as substrate. Prior to plating, a special attention was put on tuning microstructures of printed silver pads by sintering nanoparticles at various temperature ramps (0.1, 10 and 50°C/s) up to 200°C. Results show that fast sintering exhibits the lowest electrical resistivity which is suitable in printed interconnects. However, wire-bonding on nickel pads is best achieved when low sintering ramp is used. This slow sintering presents the highest adhesion strength at the nickel/silver interface since the pores dimensions were restricted to the nanoscale. The validation of the optimized bonding process came from the low electrical contact resistance between plated nickel and the bonded gold wire, and from the wire-pull test which is in accordance with the MIL-STD 883 standard. The actual results show that a compromise has to be found when emphasis is on patterning low resistive interconnects or stiff pads for wire-bonding applications. This compromise is tailored by the sintering engineering.

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Small particle melting of pure metals

Cited by 434 publications

References 20 publications

Thermodynamic properties of Pt nanoparticles: Size, shape, support, and adsorbate effects

Thermodynamic properties of Pt nanoparticles: Size, shape, support, and adsorbate effects

Surface Energy and Wetting in Island Films

Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

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