Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages

Abstract

The nanoporous nature of the inkjet printed silver nanoparticles entail low hardness and surface effective contact area for being compatible with pads that are suitable for wire-bonding in electronic packaging. Electroless nickel plating is a selective metal deposition technique which can brings the required thickness and hardness for further pads processing. Here, a 1.7 µm thick nickel layer is deposited on top of 600 nm thick printed and sintered silver nanoparticles using Kapton polyimide as substrate. Prior to plating, a special attention was put on tuning microstructures of printed silver pads by sintering nanoparticles at various temperature ramps (0.1, 10 and 50°C/s) up to 200°C. Results show that fast sintering exhibits the lowest electrical resistivity which is suitable in printed interconnects. However, wire-bonding on nickel pads is best achieved when low sintering ramp is used. This slow sintering presents the highest adhesion strength at the nickel/silver interface since the pores dimensions were restricted to the nanoscale. The validation of the optimized bonding process came from the low electrical contact resistance between plated nickel and the bonded gold wire, and from the wire-pull test which is in accordance with the MIL-STD 883 standard. The actual results show that a compromise has to be found when emphasis is on patterning low resistive interconnects or stiff pads for wire-bonding applications. This compromise is tailored by the sintering engineering.

Large-area compatible fabrication and encapsulation of inkjet-printed humidity sensors on flexible foils with integrated thermal compensation

“…The growth rate was 185 nm min −1 at a current density of 10 mA cm −2 . Nickel was considered as a suitable potential candidate for electrodeposition metal because it does not oxidize easily, it is inexpensive, possible to electroplate on silver [20][21][22] and induces lower stress than copper.…”

Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics

“…As expected, the mean grain size as well as the electrical resistivity of silver nanoparticles shows a strong dependency to sintering temperature. Note that the heating rate has been previously optimized and the 10°C/s ramp exhibits a good compromise between electrical and mechanical properties [8]. Moreover, the mean grain size of nanoparticles is clearly affected by the underlying layer as shown in Figure 2a.…”

Digital Fabrication and Integration of a Flexible Wireless Sensing Device

“…However, the contact pads on the bare die are typically small, often <100 μm square, and difficult to bond with this method because of the large size of the conductive particles in typical ACFs. Printing offers an alternative fabrication method to achieve high density and low resistance interconnections [21]. Conventional bonding processes, such as wire bonding, can be replaced with the directly printed metal interconnect.…”