Small radius bends and large angle splitters in SOI waveguides

Foresi, James; Lim, Desmond R.; Liao, Ling; Agarwal, Anuradha M.; Kimerling, Lionel C.; Tavassoli, Malahat; Cox, Mike; Cao, Min; Greene, W.

doi:10.1117/12.273843

Cited by 31 publications

(14 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This strain modifies the core/cladding refractive index locally in a way similar to roughness [Foresi97]. We have shown [Agarwal96,Foresi97] that Si/SiO 2 or polySi/SiO 2 is an ideal materials system for monolithically integrated optical signal transmission (Figure 2) that is capable of high confinement, submicron-dimensioned waveguides and micron-dimensioned radii of curvature for flexible routing [Monalato99] (See Figure 3). This capability suggests new degrees of freedom in 3-D architectural design.…”

Section: Photon Propagationmentioning

confidence: 99%

“…The device performance closely follows the photonic crystal design (Figure 9), and the measured Q of 250 is capable of fitting 128 different wavelength channels within the amplifier spectrum. The optical mode volume of the device, 0.055 m 3 , is the smallest ever created [Foresi97]. Optical microcavity resonators can enhance the intensity of Si:Er light emission by as much as 1000x.…”

Section: Photon Confinementmentioning

confidence: 99%

“…Since the resonant mode travels at the disk periphery, a microring behaves similarly. Microrings with 3 m diameter show a high Q of 250 and a free spectral range selectivity of 25 nm between channels near  = 1.5 m [Foresi97,Little98]. A silicon microring resonator is shown in Fig.…”

Section: Photon Confinementmentioning

confidence: 99%

See 2 more Smart Citations

Silicon Microphotonics

Kimerling¹

2003

Interconnect Technology and Design for Gigascale Integration

View full text Add to dashboard Cite

A rebuilding of the world's information infrastructure is taking place to give instantaneous availability of data, voice and video. This revolution of the Information Age is being gated more by the introduction of new materials and components, than by the design of systems, software and networks. Electrons transmitted through metal wires have an information carrying capacity limited by the resistance and capacitance of the cable and the terminating electronic circuits. Photons transmitted through fiber are capacity limited only by the dispersion of the medium. Each network node that requires transduction from photonics to electronics limits the performance and affordability of the network. The key frontier is the large scale integration and manufacturing of photonic components to enable the distribution of high bit rate optical streams to the individual information appliance. Microphotonics is the platform for large scale, planar integration of optical signal processing capability. INTRODUCTIONIt is now one-half century since the advent of solid state electronics with the invention of the transistor. Through unparalleled gains in functionality at relatively constant cost, integrated circuits have enabled telecommunications, computation and manufacturing to move to the leading edge of societal change. This revolution has been conducted with "the turn of a single knob": the shrinking of device dimensions. During the last two decades a new "killer technology" has emerged in the telecommunications field. This photonic technology uses optical fibers for interconnection, and has delivered an exponential increase with time of information carrying capacity to the industry. Photonics has provided unparalleled bandwidth to the backbone of the discrete, point-to-point long distance (Wide Area Network) telephone line technology. However, the circuit architecture (central switching office) that worked so well for voice communications now limits the universal access that is required for Internet and data communications. A single optical fiber, with several hundred gigabits/second of capacity, is limited by electronic processing at each circuit node. To avoid this problem optical signal processors are required: e.g., optical cross-connects and optical add/drop multiplexers. To provide full functionality, these components must be integrated at densities compatible with microelectronic integration. This microphotonics platform represents not only a solution to information access, but it can also solve the problems of bandwidth, pin-out density, reliability and complexity that threaten to end the advance of the silicon integrated circuit technology. A good figure of merit for the performance of microphotonic integrated circuits is (speed)/(power)x(area).

show abstract

Section: Photon Propagationmentioning

confidence: 99%

Section: Photon Confinementmentioning

confidence: 99%

See 1 more Smart Citation

Silicon Microphotonics

Kimerling¹

2003

Interconnect Technology and Design for Gigascale Integration

View full text Add to dashboard Cite

show abstract

“…References [28], [42], and [50]- [59] give examples of free-space systems investigated for optical interconnect applications. Waveguides on silicon chips have been investigated [60]- [62], though complete systems using these are not yet demonstrated.…”

Section: A Historical Backgroundmentioning

confidence: 99%

“…There may even therefore be an argument for the use of optical interconnects to enable relatively dense global connections on the chip. Waveguides can be contemplated on chip with cross-sectional dimensions of the order of several micrometers [60]- [62] (though devices to drive optical signals efficiently into such waveguides are still problematic), and free-space devices with areas 10 10 m appear quite feasible. Though a 10 10 m optical device is large compared to the micrometer widths of a wire, it is small compared to the total area (length width) of a global wire on a chip.…”

Section: ) Density Of Interconnectsmentioning

confidence: 99%