Smoothed particle hydrodynamics simulation and experimental analysis of SiC ceramic grinding mechanism

Liu, Yao; Li, Beizhi; Wu, Chongjun; Kong, Lingfei; Zheng, Yihao

doi:10.1016/j.ceramint.2018.03.278

Cited by 71 publications

(22 citation statements)

References 34 publications

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“…Previous studies have indicated that the principle stresses and shear stress would rise with the increase of COF during processing [27]. However, the COF between the tool surface and workpiece is usually considered as constant in previous research which is different from the actual machining processes [28]. As a result, COF should be considered as a dominating factor that affects the deformation of the hard-brittle samples [29,30].…”

Section: Introductionmentioning

confidence: 98%

Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

et al. 2020

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In order to study the influence of scratch direction on the deformation characteristics and material removal mechanism of optical glass BK7, nanoscratching experiments were conducted on a Nano indenter using Vickers indenter. Results indicate that the face-forward scratch is more likely to induce the initiation and propagation of lateral cracks, which is found to be more beneficial to material removal processes; in contrast, small chips and debris are released from the machined grooves without introducing lateral cracks in the edge-forward condition, leading to poor material removal efficiency. In addition, the choice of scratch direction can make differences to the elastic recovery rate of optical glass BK7. The results revealed that both the elastic recovery rate and the residual stresses of the material under the face-forward scratching are greater than those of the edge-forward scratching. A theoretical model for coefficient of friction (COF) under different scratch directions was established. It is found that the COF between indenter and workpiece in the edge-forward scratching is larger than the face-forward scratching under otherwise identical conditions, this finding is consistent with experimental results. A stress field analysis using finite element method (FEM) was conducted to understand the different crack initiation and propagation behaviors from different scratch directions. The current study discusses the significance of scratch direction on material removal behavior of optical glass BK7, and the results would encourage further research on investigating the connections between tool geometry and material removal mechanism.

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Section: Introductionmentioning

confidence: 98%

Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

et al. 2020

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“…The form error should be within the length of two helium light bands (0.58 μm) and the surface roughness should be at the nanometric scale to avoid surface/subsurface damages [ 9 , 10 , 11 ]. Overall, forming such a wavy face with extremely high manufacturing requirements using existing methods—for instance, lapping, polishing, general grinding, laser manufacturing, etc.—will inevitably encounter various inherent defects [ 12 , 13 , 14 , 15 , 16 , 17 ]. As a solution, a high accuracy line-contact envelope grinding method with a large diamond cup wheel based on a four-axis grinder was elaborated to fabricate such seals, and the detailed analyses of the forming principle were discussed in our previous paper [ 18 ].…”

Section: Introductionmentioning

confidence: 99%

“…Overall, forming such a wavy face with extremely high manufacturing requirements using existing methods-for instance, lapping, polishing, general grinding, laser manufacturing, etc.-will inevitably encounter various inherent defects [12][13][14][15][16][17]. As a solution, a high accuracy line-contact envelope grinding method with a large diamond cup wheel based on Micromachines 2021, 12, 388 2 of 14 a four-axis grinder was elaborated to fabricate such seals, and the detailed analyses of the forming principle were discussed in our previous paper [18].…”

Section: Introductionmentioning

confidence: 99%

Positioning Accuracy Determination of the Servo Axes for Grinding Wavy-Tilt-Dam Seals Using a Four-Axis Grinder

Gao

2021

Micromachines

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The wavy-tilt-dam (WTD) seal is considered to be one of the ideal sealing patterns used in nuclear reactor coolant pumps (RCPs). Grinding such seals with a four-axis grinder had been proposed and six grinding implementation strategies were described in our previous studies. However, another important issue is to determine the positioning accuracy of each servo axis so that the high-precision moving components can be selected properly. In the present paper, the positioning accuracy analysis is carried out to seek a balance between the manufacturing cost and the accuracy requirements. First, a geometric model is established for investigating the error sensitivity of each axis and setting reasonable accuracy allocation of the four axes. Subsequently, the combined influence of all four axes is assessed based on multi-body system (MBS) theory and homogeneous transformation matrix (HTM). According to the results calculated, positioning errors of the X-axis, Z-axis, B-axis, and C-axis within ±10 μm, ±0.1 μm, ±1 arcsec and ±60 arcsec are acceptable, respectively. Meanwhile, the form error calculated of the ground wavy face is no more than 109.74 nm. It is indicated that the accuracy level of the moving components is achievable by modern manufacturing techniques. The present paper is expected to serve as a theoretical basis for the design and development of the four-axis grinder.

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“…1. With the above numerical simulation techniques, a numerical simulation framework of brittle materials such as ceramics can be well established, and the analysis of processinduced damage can also be performed under different machining conditions [7,11,13,18,24]. In fact, many phenomena that are difficult to observe in the physical experiments can be investigated using validated computational simulations.…”

Section: Introductionmentioning

confidence: 99%

Discrete element modeling of the machining processes of brittle materials: recent development and future prospective

Jiang

Tang

et al. 2020

Int J Adv Manuf Technol

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In recent years, the discrete element method (DEM) has been used to model the bulk material, especially for the brittle materials (such as rocks, ceramics, concrete, ice, etc.) with various mechanical properties or responses by setting serials of contact properties (such as bonds) in the particle assembly. These bonds can withstand a certain amount of force and/or moment, so that the stresses executed in the bond can be used for determining the initiation and propagation of micro-crack. There are increasing evidences over the last twenty years that the DEM is becoming an effective numerical method to simulate the cracking, crushing and deformation of continuous media under external loads. The DEM has now been widely used in the field of processing and machining of rock, ceramic, concrete and other brittle materials. In this paper, the theoretical principles, formulations, contact models as well as the numerical solving processes of DEM are introduced. The applications of DEM for the machining processes of brittle and rigid materials such as ceramics are described and reviewed in detail, with future development trend also discussed.

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Smoothed particle hydrodynamics simulation and experimental analysis of SiC ceramic grinding mechanism

Cited by 71 publications

References 34 publications

Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

Positioning Accuracy Determination of the Servo Axes for Grinding Wavy-Tilt-Dam Seals Using a Four-Axis Grinder

Discrete element modeling of the machining processes of brittle materials: recent development and future prospective

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